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SUBSTRATE, AND METHOD AND DEVICE FOR POLISHING SAME

外国特許コード F060001531
整理番号 F060001531
掲載日 2007年4月2日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2006JP313601
国際公開番号 WO 2007/007683
国際出願日 平成18年7月7日(2006.7.7)
国際公開日 平成19年1月18日(2007.1.18)
優先権データ
  • 特願2005-198640 (2005.7.7) JP
発明の名称 (英語) SUBSTRATE, AND METHOD AND DEVICE FOR POLISHING SAME
発明の概要(英語) A method and a device for polishing the surface of a substrate composed of SiC ordiamond efficiently and extremely flatly without leaving sub-surface damage.A turn table (1) is turnable about a rotary shaft (4) and composed of quartz exhibitinghigh transparency to UV-rays. A large number of grooves (11) are provided in latticeon the surface of the turn table (1) and each groove (11) is filled with solid statephotocatalytic particles (20)(CeO2). When the turn table (1) is moved relativelywhile being pressed with ultrahigh pressure against the polishing surface (30A)of the substrate (30) composed of silicon carbide (SiC) or diamond (C), the polishingsurface (30A) is oxidized by the solid state photocatalytic particles (20),and chemical polishing is carried out. Oxidation of the polishing surface (30A)is accelerated by irradiation with UV-rays from a UV light source lamp (2) andpolishing is accelerated by heating with an infrared light source lamp (3).
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • National University Corporation Kumamoto University
  • 発明者(英語)
  • Watanabe, Junji
国際特許分類(IPC)
指定国 AE AG AL AM AT AU AZ BA BB BE BF BG BJ BR BW BY BZ CA CF CG CH CI CM CN CO CR CU CY CZ DE DK DM DZ EC EE EG ES FI FR GA GB GD GE GH GM GN GQ GR GW HN HR HU ID IE IL IN IS IT JP KE KG KM KN KP KR KZ LA LC LK LR LS LT LU LV LY MA MC MD MG MK ML MN MR MW MX MZ NA NE NG NI NL NO NZ OM PG PH PL PT RO RS RU SC SD SE SG SI SK SL SM SN SY SZ TD TG TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
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