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CURABLE RESIN COMPOSITION AND CURED RESIN

外国特許コード F110002793
整理番号 S2009-1044-N0
掲載日 2011年4月18日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2009JP052280
国際公開番号 WO 2009/101961
国際出願日 平成21年2月12日(2009.2.12)
国際公開日 平成21年8月20日(2009.8.20)
優先権データ
  • 特願2008-034333 (2008.2.15) JP
  • 特願2008-185529 (2008.7.17) JP
発明の名称 (英語) CURABLE RESIN COMPOSITION AND CURED RESIN
発明の概要(英語) Disclosed is a curable epoxy resin composition which has excellent toughness and is thus hardly fractured, and exhibits good adhesion to other materials, while maintaining excellent heat resistance and elastic modulus intrinsic to epoxy resins. In addition, the curable epoxy resin composition has excellent weather resistance, solvent resistance and the like. The curable epoxy resin composition contains 1-70 parts of an epoxy resin curing agent and 1-50 parts of an acrylic block copolymer per 100 parts of an epoxy resin. The acrylic block copolymer contains one or more polymer blocks A composed of a structural unit derived from an alkyl methacrylate ester and one or more polymer blocks B composed of a structural unit derived from an alkyl acrylate ester, while having a weight average molecular weight (Mw) of 30,000-300,000, a molecular weight distribution (Mw/Mn) of not more than 1.5, and a content ratio of the polymer blocks A of 3-60% by mass. A cured resin composed of the curable epoxy resin composition is also disclosed.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • KURARAY CO., LTD.
  • HYOGO
  • 発明者(英語)
  • KISHI, Hajime
  • KUNIMITSU, Yumi
  • IMADE, Jin
  • OSHITA, Shinya
  • MORISHITA, Yoshihiro
  • ASADA, Mitsunori
国際特許分類(IPC)
指定国 AE(UTILITY MODEL),AG,AL(UTILITY MODEL),AM(PROVISIONAL PATENT)(UTILITY MODEL),AO(UTILITY MODEL),AT(UTILITY MODEL),AU,AZ(UTILITY MODEL),BA,BB,BG(UTILITY MODEL),BH(UTILITY MODEL),BR(UTILITY MODEL),BW(UTILITY MODEL),BY(UTILITY MODEL),BZ(UTILITY MODEL),CA,CH,CN(UTILITY MODEL),CO(UTILITY MODEL),CR(UTILITY MODEL),CU(INVENTOR'S CERTIFICATE),CZ(UTILITY MODEL),DE(UTILITY MODEL),DK(UTILITY MODEL),DM(UTILITY MODEL),DO(UTILITY MODEL),DZ,EC(UTILITY MODEL),EE(UTILITY MODEL),EG(UTILITY MODEL),ES(UTILITY MODEL),FI(UTILITY MODEL),GB,GD,GE(UTILITY MODEL),GH(UTILITY CERTIFICATE),GM,GT(UTILITY MODEL),HN,HR(CONSENSUAL PATENT),HU(UTILITY MODEL),ID,IL,IN,IS,JP(UTILITY MODEL),KE(UTILITY MODEL),KG(UTILITY MODEL),KM,KN,KP(INVENTOR'S CERTIFICATE)(UTILITY MODEL),KR(UTILITY MODEL),KZ(PROVISIONAL PATENT)(UTILITY MODEL),LA,LC,LK,LR,LS(UTILITY MODEL),LT,LU,LY,MA,MD(UTILITY MODEL),ME,MG,MK,MN,MW,MX(UTILITY MODEL),MY(UTILITY-INNOVATION),MZ(UTILITY MODEL),NA,NG,NI(UTILITY MODEL),NO,NZ,OM(UTILITY MODEL),PG,PH(UTILITY MODEL),PL(UTILITY MODEL),PT(UTILITY MODEL),RO,RS(PETTY PATENT),RU(UTILITY MODEL),SC,SD,SE,SG,SK(UTILITY MODEL),SL(UTILITY MODEL),SM,ST,SV(UTILITY MODEL),SY,TJ(UTILITY MODEL),TM(PROVISIONAL PATENT),TN,TR(UTILITY MODEL),TT(UTILITY CERTIFICATE),TZ,UA(UTILITY MODEL),UG(UTILITY CERTIFICATE),US,UZ(UTILITY MODEL),VC(UTILITY CERTIFICATE),VN(PATENT FOR UTILITY SOLUTION),ZA,ZM,ZW,EP(AT,BE,BG,CH,CY,CZ,DE,DK,EE,ES,FI,FR,GB,GR,HR,HU,IE,IS,IT,LT,LU,LV,MC,MK,MT,NL,NO,PL,PT,RO,SE,SI,SK,TR),OA(BF(UTILITY MODEL),BJ(UTILITY MODEL),CF(UTILITY MODEL),CG(UTILITY MODEL),CI(UTILITY MODEL),CM(UTILITY MODEL),GA(UTILITY MODEL),GN(UTILITY MODEL),GQ(UTILITY MODEL),GW(UTILITY MODEL),ML(UTILITY MODEL),MR(UTILITY MODEL),NE(UTILITY MODEL),SN(UTILITY MODEL),TD(UTILITY MODEL),TG(UTILITY MODEL)),AP(BW(UTILITY MODEL),GH(UTILITY MODEL),GM(UTILITY MODEL),KE(UTILITY MODEL),LS(UTILITY MODEL),MW(UTILITY MODEL),MZ(UTILITY MODEL),NA(UTILITY MODEL),SD(UTILITY MODEL),SL(UTILITY MODEL),SZ(UTILITY MODEL),TZ(UTILITY MODEL),UG(UTILITY MODEL),ZM(UTILITY MODEL),ZW(UTILITY MODEL)),EA(AM,AZ,BY,KG,KZ,MD,RU,TJ,TM)

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