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Method for growing emiconductor crystal and laminated structure thereof and semiconductor device

外国特許コード F110005979
整理番号 K02008TW
掲載日 2011年12月15日
出願国 台湾
出願番号 93107211
公報番号 200425288
公報番号 I320948
出願日 平成16年3月18日(2004.3.18)
公報発行日 平成16年11月16日(2004.11.16)
公報発行日 平成22年2月21日(2010.2.21)
優先権データ
  • 特願2003-076044 (2003.3.19) JP
発明の名称 (英語) Method for growing emiconductor crystal and laminated structure thereof and semiconductor device
発明の概要(英語) SiC is a very stable material. It is difficult to control a SiC surface for suitably growing crystal in an ordinary III nitride crystal growth apparatus. For this reason, the steps as follows have been performed. Under the heat treatment of HCl gas, a step-terrace structure is formed on the surface of the SiC substrate 1. By performing chemical treatment on the surface of the SiC substrate with aqua regia, hydrochloric acid and fluoric acid in sequence, and etching the silicon oxide film which is formed on the surface of the SiC substrate, a clean surface 3 of the SiC substrate is formed. Then, the SiC substrate is installed into a high-vacuum apparatus which is kept in ultrahigh-vacuum condition such as 10< SP> -6< /SP> ~10< SP> -8< /SP> Pa. On timing t1, an atomic beam of Ga is applied under ultrahigh vacuum condition and a temperature below 800 DEG C. After that, the substrate is subjected to a heat treatment under a temperature above 800 DEG C. The process of atomic beam application and heat treatment has to be performed more than one time. The growing temperature of A1N film is set, and A1 atom is applied to the surface of SiC substrate under ultrahigh vacuum condition before N atom is supplied.
  • 出願人(英語)
  • JAPAN SCIENCE AND TECHNOLOGY AGENCY
  • 発明者(英語)
  • SUDA, JUN,
  • MATSUNAMI, HIROYUKI,
  • ONOJIMA, NORIO
国際特許分類(IPC)
参考情報 (研究プロジェクト等) PRESTO Nanostructure and Material Property AREA
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