TOP > 外国特許検索 > METHOD FOR BONDING HARDENED SILICONE RESIN, METHOD FOR JOINING SUBSTRATE HAVING FINE STRUCTURE, AND METHOD FOR MANUFACTURING MICRO FLUID DEVICE USING THE METHOD FOR JOINING.

METHOD FOR BONDING HARDENED SILICONE RESIN, METHOD FOR JOINING SUBSTRATE HAVING FINE STRUCTURE, AND METHOD FOR MANUFACTURING MICRO FLUID DEVICE USING THE METHOD FOR JOINING. 新技術説明会

外国特許コード F120006369
整理番号 S2011-0828-N0
掲載日 2012年3月27日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2011JP000245
国際公開番号 WO 2011/089892
国際出願日 平成23年1月19日(2011.1.19)
国際公開日 平成23年7月28日(2011.7.28)
優先権データ
  • 特願2010-165916 (2010.7.23) JP
  • 特願2010-008956 (2010.1.19) JP
発明の名称 (英語) METHOD FOR BONDING HARDENED SILICONE RESIN, METHOD FOR JOINING SUBSTRATE HAVING FINE STRUCTURE, AND METHOD FOR MANUFACTURING MICRO FLUID DEVICE USING THE METHOD FOR JOINING. 新技術説明会
発明の概要(英語) Disclosed is a novel method for bonding hardened silicone resin. Further disclosed is a method for joining a cover substrate and a main substrate whereon a nano-size structure having recesses and projections is formed, without damaging said recessed and projected structure, and a method for manufacturing a micro fluid device which is provided with a nano flow channel using the joining method. The surface of a substrate made from hardened silicone resin is excited by means of atmospheric pressure plasma irradiation or vacuum ultraviolet light irradiation and then the surface of the hardened silicone resin substrate and a glass substrate or similar are overlayed and pushing pressure is applied, thus bonding both substrates without using heat or an adhesive. Also, by applying a silicone rubber composition to the joining surface of the cover substrate, then hardening the composition to form a silicone rubber layer, then adhering together the surface of the main substrate whereon a structure having recesses and projection is formed, and the silicone rubber layer on the cover substrate, and subsequently, with the substrates in this adhered state, irradiating ultraviolet rays from the main substrate side, a silicon oxide film is formed on the joining boundary thus both substrates are strongly adhered together.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • TOKYO INSTITUTE OF TECHNOLOGY
  • 発明者(英語)
  • YAMAMOTO, Takatoki
国際特許分類(IPC)
指定国 AE(UTILITY MODEL),AG,AL(UTILITY MODEL),AM(PROVISIONAL PATENT)(UTILITY MODEL),AO(UTILITY MODEL),AT(UTILITY MODEL),AU,AZ(UTILITY MODEL),BA,BB,BG(UTILITY MODEL),BH(UTILITY MODEL),BR(UTILITY MODEL),BW,BY(UTILITY MODEL),BZ(UTILITY MODEL),CA,CH,CL(UTILITY MODEL),CN(UTILITY MODEL),CO(UTILITY MODEL),CR(UTILITY MODEL),CU(INVENTOR'S CERTIFICATE),CZ(UTILITY MODEL),DE(UTILITY MODEL),DK(UTILITY MODEL),DM,DO(UTILITY MODEL),DZ,EC(UTILITY MODEL),EE(UTILITY MODEL),EG(UTILITY MODEL),ES(UTILITY MODEL),FI(UTILITY MODEL),GB,GD,GE(UTILITY MODEL),GH(UTILITY CERTIFICATE),GM,GT(UTILITY MODEL),HN(UTILITY MODEL),HR(CONSENSUAL PATENT),HU(UTILITY MODEL),ID,IL,IN,IS,KE(UTILITY MODEL),KG(UTILITY MODEL),KM,KN,KP(INVENTOR'S CERTIFICATE)(UTILITY MODEL),KR(UTILITY MODEL),KZ(PROVISIONAL PATENT)(UTILITY MODEL),LA,LC,LK,LR,LS(UTILITY MODEL),LT,LU,LY,MA,MD(UTILITY MODEL),ME,MG,MK,MN,MW,MX(UTILITY MODEL),MY(UTILITY-INNOVATION),MZ(UTILITY MODEL),NA,NG,NI(UTILITY MODEL),NO,NZ,OM(UTILITY MODEL),PE(UTILITY MODEL),PG,PH(UTILITY MODEL),PL(UTILITY MODEL),PT(UTILITY MODEL),RO,RS(PETTY PATENT),RU(UTILITY MODEL),SC,SD,SE,SG,SK(UTILITY MODEL),SL(UTILITY MODEL),SM,ST,SV(UTILITY MODEL),SY,TH(PETTY PATENT),TJ(UTILITY MODEL),TM(PROVISIONAL PATENT),TN,TR(UTILITY MODEL),TT(UTILITY CERTIFICATE),TZ,UA(UTILITY MODEL),UG(UTILITY CERTIFICATE),US,UZ(UTILITY MODEL),VC(UTILITY CERTIFICATE),VN(PATENT FOR UTILITY SOLUTION),ZA,ZM,ZW,EP(AL,AT,BE,BG,CH,CY,CZ,DE,DK,EE,ES,FI,FR,GB,GR,HR,HU,IE,IS,IT,LT,LU,LV,MC,MK,MT,NL,NO,PL,PT,RO,RS,SE,SI,SK,SM,TR),OA(BF(UTILITY MODEL),BJ(UTILITY MODEL),CF(UTILITY MODEL),CG(UTILITY MODEL),CI(UTILITY MODEL),CM(UTILITY MODEL),GA(UTILITY MODEL),GN(UTILITY MODEL),GQ(UTILITY MODEL),GW(UTILITY MODEL),ML(UTILITY MODEL),MR(UTILITY MODEL),NE(UTILITY MODEL),SN(UTILITY MODEL),TD(UTILITY MODEL),TG(UTILITY MODEL)),AP(BW(UTILITY MODEL),GH(UTILITY MODEL),GM(UTILITY MODEL),KE(UTILITY MODEL),LR(UTILITY MODEL),LS(UTILITY MODEL),MW(UTILITY MODEL),MZ(UTILITY MODEL),NA(UTILITY MODEL),SD(UTILITY MODEL),SL(UTILITY MODEL),SZ(UTILITY MODEL),TZ(UTILITY MODEL),UG(UTILITY MODEL),ZM(UTILITY MODEL),ZW(UTILITY MODEL)),EA(AM,AZ,BY,KG,KZ,MD,RU,TJ,TM)
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