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APPARATUS AND METHOD FOR MEASURING STRAIN IN MICRO MATERIAL

外国特許コード F120006622
整理番号 S2010-0781
掲載日 2012年5月17日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2011JP062565
国際公開番号 WO 2011/152441
国際出願日 平成23年6月1日(2011.6.1)
国際公開日 平成23年12月8日(2011.12.8)
優先権データ
  • 特願2010-127109 (2010.6.2) JP
発明の名称 (英語) APPARATUS AND METHOD FOR MEASURING STRAIN IN MICRO MATERIAL
発明の概要(英語) Disclosed is an apparatus for measuring strain in micro materials which enables the strain of a micro material to be accurately measured in a noncontact fashion when the material is subjected to tensile stress or compressive stress. The apparatus has a measuring section (150) and a strain generating section (130). The measuring section (150) includes a CCD camera (170) for sensing an interference beam of light that is formed of a measurement beam from a measured region (108) and a reference beam from a reference mirror (166D); a first objective lens (166) including the reference mirror (166D); and an image processor for measuring the three-dimensional shape of the measured region (108) from the position of the first objective lens (166) at which the interference beam of light has the maximum contrast and measuring the distance between two reference points on the basis of the three-dimensional shape. The strain generating section (130) includes a load cell (146) for measuring tensile stress and an inching X stage (140) for generating strain, wherein when strain has been generated on the micro material (102), the strain is determined for tensile stress on the basis of the measured tensile stress and the distance between the two reference points that has been changed due to the strain.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • Kumamoto University
  • SIGMA KOKI CO., LTD.
  • 発明者(英語)
  • TAKASHIMA, Kazuki
  • OTSU, Masaaki
  • MATSUDA, Mitsuhiro
  • KURAHARA, Hiroaki
  • MAEDA, Hidetaka
  • YONEKURA, Tadahiro
国際特許分類(IPC)
指定国 AE(UTILITY MODEL),AG,AL(UTILITY MODEL),AM(PROVISIONAL PATENT)(UTILITY MODEL),AO(UTILITY MODEL),AT(UTILITY MODEL),AU,AZ(UTILITY MODEL),BA(CONSENSUAL PATENT),BB,BG(UTILITY MODEL),BH(UTILITY MODEL),BR(UTILITY MODEL),BW,BY(UTILITY MODEL),BZ(UTILITY MODEL),CA,CH,CL(UTILITY MODEL),CN(UTILITY MODEL),CO(UTILITY MODEL),CR(UTILITY MODEL),CU(INVENTOR'S CERTIFICATE),CZ(UTILITY MODEL),DE(UTILITY MODEL),DK(UTILITY MODEL),DM,DO(UTILITY MODEL),DZ,EC(UTILITY MODEL),EE(UTILITY MODEL),EG(UTILITY MODEL),ES(UTILITY MODEL),FI(UTILITY MODEL),GB,GD,GE(UTILITY MODEL),GH(UTILITY CERTIFICATE),GM,GT(UTILITY MODEL),HN(UTILITY MODEL),HR(CONSENSUAL PATENT),HU(UTILITY MODEL),ID,IL,IN,IS,JP(UTILITY MODEL),KE(UTILITY MODEL),KG(UTILITY MODEL),KM,KN,KP(INVENTOR'S CERTIFICATE)(UTILITY MODEL),KR(UTILITY MODEL),KZ(PROVISIONAL PATENT)(UTILITY MODEL),LA,LC,LK,LR,LS(UTILITY MODEL),LT,LU,LY,MA,MD(UTILITY MODEL),ME,MG,MK,MN,MW,MX(UTILITY MODEL),MY(UTILITY-INNOVATION),MZ(UTILITY MODEL),NA,NG,NI(UTILITY MODEL),NO,NZ,OM(UTILITY MODEL),PE(UTILITY MODEL),PG,PH(UTILITY MODEL),PL(UTILITY MODEL),PT(UTILITY MODEL),RO,RS(PETTY PATENT),RU(UTILITY MODEL),SC,SD,SE,SG,SK(UTILITY MODEL),SL(UTILITY MODEL),SM,ST,SV(UTILITY MODEL),SY,TH(PETTY PATENT),TJ(UTILITY MODEL),TM(PROVISIONAL PATENT),TN,TR(UTILITY MODEL),TT(UTILITY CERTIFICATE),TZ,UA(UTILITY MODEL),UG(UTILITY CERTIFICATE),US,UZ(UTILITY MODEL),VC(UTILITY CERTIFICATE),VN(PATENT FOR UTILITY SOLUTION),ZA,ZM,ZW,EP(AL,AT,BE,BG,CH,CY,CZ,DE,DK,EE,ES,FI,FR,GB,GR,HR,HU,IE,IS,IT,LT,LU,LV,MC,MK,MT,NL,NO,PL,PT,RO,RS,SE,SI,SK,SM,TR),OA(BF(UTILITY MODEL),BJ(UTILITY MODEL),CF(UTILITY MODEL),CG(UTILITY MODEL),CI(UTILITY MODEL),CM(UTILITY MODEL),GA(UTILITY MODEL),GN(UTILITY MODEL),GQ(UTILITY MODEL),GW(UTILITY MODEL),ML(UTILITY MODEL),MR(UTILITY MODEL),NE(UTILITY MODEL),SN(UTILITY MODEL),TD(UTILITY MODEL),TG(UTILITY MODEL)),AP(BW(UTILITY MODEL),GH(UTILITY MODEL),GM(UTILITY MODEL),KE(UTILITY MODEL),LR(UTILITY MODEL),LS(UTILITY MODEL),MW(UTILITY MODEL),MZ(UTILITY MODEL),NA(UTILITY MODEL),SD(UTILITY MODEL),SL(UTILITY MODEL),SZ(UTILITY MODEL),TZ(UTILITY MODEL),UG(UTILITY MODEL),ZM(UTILITY MODEL),ZW(UTILITY MODEL)),EA(AM,AZ,BY,KG,KZ,MD,RU,TJ,TM)
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