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POSITIVE ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING METHOD USING POSITIVE ELECTRODE

外国特許コード F130007273
整理番号 S2011-1118-N0
掲載日 2013年4月5日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2012JP072237
国際公開番号 WO 2013/038928
国際出願日 平成24年8月31日(2012.8.31)
国際公開日 平成25年3月21日(2013.3.21)
優先権データ
  • 特願2011-199258 (2011.9.13) JP
発明の名称 (英語) POSITIVE ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING METHOD USING POSITIVE ELECTRODE
発明の概要(英語)

Provided are: a positive electrode for electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein the positive electrode has a lower electric potential, and the electrolysis voltage and basic units of electrical energy can be reduced in comparison to a conventional positive electrode, and which is low-cost and can be used as a positive electrode for electrolytic plating for a variety of types of metals

and an electrolytic plating method in which an aqueous solution serves as the electrolytic solution, wherein the electrical potential of the positive electrode and the electrolytic voltage are lower and the basic units of electrical energy can be reduced. This positive electrode for electrolytic plating is used in electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein a catalyst layer comprising amorphous ruthenium oxide and amorphous tantalum oxide has been formed atop an electroconductive substrate.

  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • THE DOSHISHA,
  • MORIMITSU MASATSUGU
  • 発明者(英語)
  • MORIMITSU MASATSUGU
国際特許分類(IPC)

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