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STRESS-ALLEVIATING SUBSTRATE AND TEXTILE DEVICE UPDATE

外国特許コード F170009061
整理番号 E114P26WO
掲載日 2017年4月26日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2016JP080527
国際公開番号 WO 2017065270
国際出願日 平成28年10月14日(2016.10.14)
国際公開日 平成29年4月20日(2017.4.20)
優先権データ
  • 特願2015-204499 (2015.10.16) JP
発明の名称 (英語) STRESS-ALLEVIATING SUBSTRATE AND TEXTILE DEVICE UPDATE
発明の概要(英語) To provide a stress-alleviating substrate for alleviating stress generated due to differences in the hardness of a circuit substrate and a fabric. This stress-alleviating substrate is positioned between a wired fabric and a circuit substrate, wherein the stress-alleviating substrate is provided with a stress-alleviating layer harder than the fabric yet softer than the circuit substrate, an adhesive layer provided on one surface of the stress-alleviating layer, and a conductor provided on the stress-alleviating layer to span between a first surface and a second surface.
特許請求の範囲(英語) [claim1]
1. Being the stress relief baseplate which distribution facilities is done with the cloth body and the circuit baseplate which possess wiring,
The stress relief layer which is harder than the aforementioned cloth body, is softer than the aforementioned circuit baseplate and,
The gluing layer where the aforementioned stress relief layer is provided all over and,
The 1st aspect of the aforementioned stress relief baseplate and over the 2nd aspect distribution facilities the conductive part which is done and, the stress relief baseplate which it has.
[claim2]
2. In the claim 1 whose bendability of the aforementioned stress relief baseplate is larger than bendability of the aforementioned circuit baseplate and the aforementioned cloth body the stress relief baseplate of statement.
[claim3]
3. The claim in either 1 where the aforementioned gluing layer is thermoplastic resin layer or 2 the stress relief baseplate of statement.
[claim4]
4. The aforementioned conductive part, either of the claim 1-3 which includes beer wiring which is provided in the perforation hole which penetrates the aforementioned stress relief layer and the aforementioned gluing layer in one section the stress relief baseplate of statement.
[claim5]
5. The aforementioned conductive part, the aforementioned stress relief layer and the aforementioned gluing layer either of the claim 1-3 which includes the electric conduction thread which part exposes in the batten and both sides in one section the stress relief baseplate of statement.
[claim6]
6. Either of the claim 1-5 which possesses the circuit baseplate installation territory in the plane surface apparent with central part, from outer circle facing toward the aforementioned circuit baseplate installation territory the aforementioned conductive part distribution facilities is done in one section the stress relief baseplate of statement.
[claim7]
7. Wiring density of the aforementioned conductive part, the claim 6 which becomes high from outer circle facing toward the aforementioned circuit baseplate installation territory the stress relief baseplate of statement.
[claim8]
8. When hardness of the aforementioned cloth body the [ri], at the same time hardness of the aforementioned circuit baseplate is above 3.0x10(5) N/m and below 7.5x10(5) N/m above 10N/m and below 1000N/m, hardness of the aforementioned stress relief layer is above 1000N/m and below 3.0x10(5) N/m;
When bendability of the aforementioned cloth body 10 the 1.0x10 (- 10) is N m, or less at the same time bendability of the circuit baseplate the 1.0x10 (- 4) N m or more, the 5.0x10 (- 3) is N m or less, as for bendability of the aforementioned stress relief layer the 5.0x10 (- 3) either of the claim 1-7 which N m or more and is 0.5N m or less in one section the stress relief baseplate of statement.
[claim9]
9. Stress relief layer and,
The gluing layer where the aforementioned stress relief layer is provided all over and,
Conductive part and,
Being the stress relief baseplate which it has,
The aforementioned conductive part distribution facilities it is done the 1st aspect of the aforementioned stress relief baseplate and over the 2nd aspect,
Hardness of the aforementioned stress relief layer is above 1000N/m and below 3.0x10(5) N/m,
As for bendability of the aforementioned stress relief layer the 5.0x10 (- 3) the stress relief baseplate which features that N m or more and it is 0.5N m or less.
[claim10]
10. The cloth body which possesses elastic wiring and,
The circuit baseplate where circuit wiring was formed and,
Between the aforementioned cloth body and the aforementioned circuit baseplate distribution facilities either of the claim 1-9 which is done in one section the stress relief baseplate of statement and, having,
The aforementioned elastic wiring and the aforementioned circuit wiring, the beefsteak style type device which is connected by the aforementioned conductive part of the aforementioned stress relief baseplate.
[claim11]
11. Plane surface wiring density of the apparent with aforementioned conductive part, the claim 10 which becomes high facing toward the aforementioned circuit baseplate the beefsteak style type device of statement.
[claim12]
12. The area of the aforementioned stress relief baseplate, is larger than the area of the aforementioned circuit baseplate,
Plane surface the apparent with aforementioned circuit baseplate, in the position where it is piled up with the aforementioned stress relief baseplate distribution facilities the claim in either 10 which is done or 11 the beefsteak style type device of statement.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • JAPAN SCIENCE AND TECHNOLOGY AGENCY
  • 発明者(英語)
  • NAKAJIMA MASAO
  • AMIMORI ICHIRO
  • SAWANOBORI OSAMU
  • SOMEYA TAKAO
国際特許分類(IPC)
指定国 (WO201765270)
National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JP KE KG KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
参考情報 (研究プロジェクト等) ERATO SOMEYA Bio-Harmonized Electronics AREA
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