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SEMICONDUCTOR INSPECTION DEVICE NEW コモンズ 新技術説明会 実績あり

外国特許コード F170009272
整理番号 KIT15009PCT
掲載日 2017年10月31日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2016JP073445
国際公開番号 WO 2017026483
国際出願日 平成28年8月9日(2016.8.9)
国際公開日 平成29年2月16日(2017.2.16)
優先権データ
  • 特願2015-158228 (2015.8.10) JP
発明の名称 (英語) SEMICONDUCTOR INSPECTION DEVICE NEW コモンズ 新技術説明会 実績あり
発明の概要(英語) Provided is a semiconductor inspection device 10 having an ultrasound probe 14 for transmitting ultrasonic waves which propagate through a liquid 12 inside a liquid tank 11 to reach a semiconductor element 13, and an analysis means 27 for detecting abnormalities of the semiconductor element 13 based on the received ultrasonic waves, the semiconductor inspection device (10) being provided with: a current applying means 17 that is connected to the semiconductor element 13, energizes the semiconductor element 13, and operates the semiconductor element 13; and flow generation means 16, 23, 24, 25 for generating a flow in the liquid 12 inside the water tank 11.
特許請求の範囲(英語) [claim1]
1. In the liquid of liquid inside the tank being spread, in the ultrasonic probe which dispatches the ultra wave which arrives in the semiconductor device and the semiconductor survey instrument which possesses with the analytical expedient which detects the abnormality of the aforementioned semiconductor device on the basis of the ultra wave which is received,
The electric current impression expedient where it is connected by the aforementioned semiconductor device, turns on electricity to the said semiconductor device and operates the said semiconductor device and,
The semiconductor survey instrument which features that the flow occurrence expedient which generates the flow to the liquid of the aforementioned liquid inside the tank is had.
[claim2]
2. In the semiconductor survey instrument of claim 1 statement, the semiconductor survey instrument which features that it possesses the blowing coming out nozzle which the aforementioned flow occurrence expedient gushes and, into the aforementioned liquid, the said liquid allots the mouth.
[claim3]
3. In the semiconductor survey instrument of claim 2 statement, the semiconductor survey instrument which features that it has the probe transport mechanism which makes the aforementioned ultrasonic probe move vis-a-vis the aforementioned semiconductor device as for the aforementioned blowing coming out nozzle, with the aforementioned ultrasonic probe it moves.
[claim4]
4. In the semiconductor survey instrument of claim 3 statement, the semiconductor survey instrument which features that the liquid thermometry expedient which measures the temperature of the liquid of the aforementioned liquid inside the tank furthermore is had.
[claim5]
5. Claim in the semiconductor survey instrument of 3 or 4 statements, the semiconductor survey instrument which features that the probe thermometry expedient which measures the temperature of the aforementioned ultrasonic probe furthermore is had.
[claim6]
6. In the semiconductor survey instrument of claim 1 statement, as for the aforementioned flow occurrence expedient, inside the aforementioned liquid, the semiconductor survey instrument which features that it possesses the absorption nozzle which allots the sucking mouth of the said liquid.
[claim7]
7. In the semiconductor survey instrument of claim 6 statement, the semiconductor survey instrument which features that it has the probe transport mechanism which makes the aforementioned ultrasonic probe move vis-a-vis the aforementioned semiconductor device as for the aforementioned absorption nozzle, with the aforementioned ultrasonic probe it moves.
[claim8]
8. In the liquid of liquid inside the tank being spread, in the ultrasonic probe which dispatches the ultra wave which arrives in the semiconductor device and the semiconductor survey instrument which possesses with the analytical expedient which detects the abnormality of the aforementioned semiconductor device on the basis of the ultra wave which is received,
The electric current impression expedient where it is connected by the aforementioned semiconductor device, turns on electricity to the said semiconductor device and operates the said semiconductor device and,
The semiconductor survey instrument which features that it has with the contactor which is touched the air bubble which it occurs in the said semiconductor device with the heat generation with the operation of the aforementioned semiconductor device makes the aforementioned contactor move, removes the aforementioned air bubble from the aforementioned semiconductor device.
[claim9]
9. In the semiconductor survey instrument of claim 8 statement, the semiconductor survey instrument which features that it has the probe transport mechanism which makes the aforementioned ultrasonic probe move vis-a-vis the aforementioned semiconductor device as for the aforementioned contactor, with the aforementioned ultrasonic probe it moves.
[claim10]
10. In the semiconductor survey instrument of claim 9 statement, the semiconductor survey instrument which features that the liquid thermometry expedient which measures the temperature of the liquid of the aforementioned liquid inside the tank furthermore is had.
[claim11]
11. Claim in the semiconductor survey instrument of 9 or 10 statements, the semiconductor survey instrument which features that the probe thermometry expedient which measures the temperature of the aforementioned ultrasonic probe furthermore is had.
[claim12]
12. The liquid of liquid inside the tank being spread, in the ultrasonic probe which dispatches the ultra wave which arrives in the semiconductor device and the semiconductor survey instrument which possesses with the analytical expedient which detects the abnormality of the aforementioned semiconductor device on the basis of the ultra wave which is received,
The electric current impression expedient where it is connected by the aforementioned semiconductor device, turns on electricity to the said semiconductor device and operates the said semiconductor device and,
The semiconductor survey instrument which features that the vibrating occurrence expedient which gives the vibration to the aforementioned semiconductor device is had.
[claim13]
13. In the semiconductor survey instrument of claim 12 statement, the semiconductor survey instrument which features that the liquid thermometry expedient which measures the temperature of the liquid of the aforementioned liquid inside the tank furthermore is had.
[claim14]
14. Claim in the semiconductor survey instrument of 12 or 13 statements, the semiconductor survey instrument which features that the probe thermometry expedient which measures the temperature of the aforementioned ultrasonic probe furthermore is had.
[claim15]
15. The semiconductor survey instrument which features that either of the claim 1-14 in 1 sections the aforementioned analytical expedient guides the internal picture of the aforementioned semiconductor device on the basis of the ultra wave which is received in the semiconductor survey instrument of statement, detects the abnormality of the said semiconductor device a on the basis of the picture inside the said.
[claim16]
16. In the semiconductor survey instrument of claim 15 statement, as for the aforementioned analytical expedient, the picture inside the description above which guides the aforementioned semiconductor device of operating state in the object, by comparison with the picture inside the description above which guides the said semiconductor device before the operating in the object, the semiconductor survey instrument which features that inside the picture inside the said of the said semiconductor device which is in the midst of operating, when the area of the territory where from the picture inside the said of the said semiconductor device before the operating it changes is above specified size it is abnormal in the said semiconductor device and with it decides.
[claim17]
17. In the semiconductor survey instrument of claim 15 statement, as for the aforementioned analytical expedient, the picture inside the description above which guides the aforementioned semiconductor device after the operating in the object, by comparison with the picture inside the description above which guides the said semiconductor device before the operating in the object, the semiconductor survey instrument which features that inside the picture inside the said of the said semiconductor device after the operating, when the area of the territory where from the picture inside the said of the said semiconductor device before the operating it changes is above specified size it is abnormal in the said semiconductor device and with it decides.
[claim18]
18. The semiconductor survey instrument which features that either of the claim 1-17 opening is formed by the bottom of the aforementioned liquid tank to 1 sections in the semiconductor survey instrument of statement, as for the aforementioned semiconductor device, from outside the aforementioned liquid tank sticking on bottom of the said liquid tank, closes the aforementioned opening.
[claim19]
19. Either of the claim 1-18 in 1 sections the semiconductor survey instrument which features that the cooling expedient which cools the aforementioned liquid in the semiconductor survey instrument of statement, is had, furthermore.
[claim20]
20. Measures the temperature of the aforementioned semiconductor device in the semiconductor survey instrument of statement, the element thermometry expedient which, furthermore is had for 1 sections, either of the claim 1-19 on the basis of the output value of the said element thermometry expedient, the semiconductor survey instrument which features that abnormality of the aforementioned semiconductor device is detected.
[claim21]
21. The semiconductor survey instrument which features that either of the claim 1-20 size of the curvature which it occurs in the aforementioned semiconductor device is done the image pickup expedient which, with electrification in the semiconductor survey instrument of statement, appearance of the aforementioned semiconductor device image pickup, the aforementioned image pickup expedient furthermore has with the deformation detection expedient which is sought from the picture which image pickup is done, for 1 sections, on the basis of the size of the curvature of the aforementioned semiconductor device, detects the abnormality of the said semiconductor device.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • KYUSHU INSTITUTE OF TECHNOLOGY
  • 発明者(英語)
  • OMURA ICHIRO
  • WATANABE AKIHIKO
  • TSUKUDA MASANORI
国際特許分類(IPC)
指定国 (WO201726483)
National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JP KE KG KN KP KR KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
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