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SOLUTION FOR DISSOLVING METAL OR METAL SALT, AND USE OF SAME NEW 新技術説明会

外国特許コード F200010077
整理番号 5911
掲載日 2020年5月15日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2018JP042842
国際公開番号 WO 2019138697
国際出願日 平成30年11月20日(2018.11.20)
国際公開日 令和元年7月18日(2019.7.18)
優先権データ
  • 特願2018-004381 (2018.1.15) JP
  • 特願2018-125097 (2018.6.29) JP
発明の名称 (英語) SOLUTION FOR DISSOLVING METAL OR METAL SALT, AND USE OF SAME NEW 新技術説明会
発明の概要(英語) The purpose of the present invention is to provide: an improved novel solution for dissolving a metal or a metal salt; and a plating liquid and the like, each of which contains the solution. One embodiment of the present invention provides: a solution for dissolving a metal or a metal salt, in which a solute having a specific property and including anions (for example halide ions) at a high concentration is dissolved; or a plating liquid or the like, which contains the solution and a metal or a metal salt that is dissolved in the solution.
従来技術、競合技術の概要(英語) BACKGROUND ART
Plating techniques, artistic crafts products, jewelry, art decoration such as a dishwasher, a connector, switch, the field of electronic components such as IC lead frame, such as semiconductor field, many of the processing surface used in the art.
Plating techniques used in the plating solution ('plating bath' is also referred to.) Is, the solubility of the metal plating, deposition rate, affects the quality of plating. Therefore, the plating solution is, one of the important elements in the plating technique, the use of an appropriate plating solution for plating to obtain a high quality is important.
However, a conventional plating solution, strong acid, strong alkali solution such as the dangerous obstacle, powerful drug, toxins such as cyanide, the high cost organic compound and the like, such as industrial handling difficult problem in many cases.
In addition, the conventional plating solution, the plating solution in order to obtain a sufficient solubility of the metal, the addition of the complexing agent is often performed. As a result, the effect itself of addition of the complexing agent, for example, nitrogen, carbon, sulfur or the like by mixing, and reduction of the productivity and cause deterioration in the quality of plating, the plating solution is difficult to control the problem.
Further, the conventional plating solution, plating processing is performed using the same time, the hydrogen-producing side reactions may occur. As a result, the main reaction of the plating is used to generate the electrical quantity (current efficiency) is reduced to, lowering the productivity of plating is a problem. In particular, in the case of the chromium plating or the like, the occurrence of cracking and hydrogen occlusion for a direct, the obtained plating of the plating film quality problem occurs.
Under such circumstances, the substitute in the plating solution in the plating solution in the prior art has been actively performed.
Alternative for the plating solution of, for example, toxic cyanide-free plating solution (non-patent document 1), and the like (Non-Patent Document 2) the ionic liquid have been reported.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • KYOTO UNIVERSITY
  • 発明者(英語)
  • KITADA ATSUSHI
  • ADACHI, Ken
  • MURASE, Kuniaki
国際特許分類(IPC)
指定国 National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
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