TOP > 外国特許検索 > HETEROEPITAXIAL STRUCTURE AND METHOD FOR PRODUCING SAME, METAL LAYERED PRODUCT CONTAINING HETEROEPITAXIAL STRUCTURE AND METHOD FOR PRODUCING SAME, AND NANOGAP ELECTRODE AND METHOD FOR PRODUCING NANOGAP ELECTRODE

HETEROEPITAXIAL STRUCTURE AND METHOD FOR PRODUCING SAME, METAL LAYERED PRODUCT CONTAINING HETEROEPITAXIAL STRUCTURE AND METHOD FOR PRODUCING SAME, AND NANOGAP ELECTRODE AND METHOD FOR PRODUCING NANOGAP ELECTRODE NEW 新技術説明会

外国特許コード F200010184
整理番号 (J1035-03)
掲載日 2020年7月28日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2019JP034167
国際公開番号 WO 2020071025
国際出願日 令和元年8月30日(2019.8.30)
国際公開日 令和2年4月9日(2020.4.9)
優先権データ
  • 特願2018-187109 (2018.10.2) JP
  • 特願2019-005299 (2019.1.16) JP
発明の名称 (英語) HETEROEPITAXIAL STRUCTURE AND METHOD FOR PRODUCING SAME, METAL LAYERED PRODUCT CONTAINING HETEROEPITAXIAL STRUCTURE AND METHOD FOR PRODUCING SAME, AND NANOGAP ELECTRODE AND METHOD FOR PRODUCING NANOGAP ELECTRODE NEW 新技術説明会
発明の概要(英語) This heteroepitaxial structure includes: a first metal part having a polycrystalline structure; and a second metal part on the first metal part. The second metal part has an island-like structure on the first metal part. The second metal part is provided so as to correspond to at least one crystal grain that is exposed at the surface of the first metal part. The second metal part and at least one crystal grain form a heteroepitaxial boundary. The first metal part preferably contains at least one element selected from among platinum (Pt), palladium (Pd), rhodium (Rd), ruthenium (Ru), osmium (Os) and iridium (Ir). The second metal part is preferably gold (Au).
従来技術、競合技術の概要(英語) BACKGROUND ART
Electrolytic plating and electroless plating is widely used industrially and in one of the techniques, has been used in various applications. For example, by plating gold by the producer of the electronic component electrode is processed and the technology is becoming pervasive. Gold (Au) is chemically very stable metal, widely used electronic components. For example, in electronic components, good wettability of solder or wire bonding can be made, are used as an electrode material. (Au) coating of gold can be formed by electrolytic plating. However, since the soft metal gold (Au), gold (Au) coating may be formed by electrolytic plating, the substrate surface (Co) cobalt, nickel (Ni) or the like of the hard plating film is formed are realized.
Plating technique is known from the past, various studies have currently been made. For example, platinum (Pt) gold (Au) by electrolytic plating on the coating growth layer of the research has been reported (see Non-Patent Document 1). In addition, spherical platinum (Pt) on the surface of the seed layer, gold chloride (III) the gold (Au) is reduced from the deposit has been disclosed a technique (see Patent Document 1).
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • JAPAN SCIENCE AND TECHNOLOGY AGENCY
  • 発明者(英語)
  • MAJIMA Yutaka
  • CHOI YoonYoung
  • SHIMADA Ikuko
  • TOYAMA Ryo
  • YANG Mingyue
国際特許分類(IPC)
指定国 National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO JP KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
ライセンスをご希望の方、特許の内容に興味を持たれた方は、問合せボタンを押してください。

PAGE TOP

close
close
close
close
close
close