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DEPSIPEPTIDE CONTAINING LACTIC ACID RESIDUE meetings

Foreign code F110002522
File No. S2006-1351-C0
Posted date Mar 14, 2011
Country WIPO
International application number 2007JP065720
International publication number WO 2008/023582
Date of international filing Aug 10, 2007
Date of international publication Feb 28, 2008
Priority data
  • P2006-228281 (Aug 24, 2006) JP
Title DEPSIPEPTIDE CONTAINING LACTIC ACID RESIDUE meetings
Abstract Disclosed are a compound represented by the general formula (I) below and a polymer compound obtained by polymerizing such a compound. R1-Gly-Lac-Pro-R2 (I) (In the formula, -Gly-Lac-Pro- represents a glycine residue represented by the formula (II) below, a lactic acid residue and a tridepsipeptide linked with a proline residue; R1 represents an amino acid, polypeptide or hydroxycarboxylic acid linked by an amide bond; and R2 represents an amino acid or polypeptide linked by an amide bond, or a hydroxycarboxylic acid linked by an ester bond. (II)
Scope of claims (In Japanese)
【請求項1】下記一般式 (I)R1-Gly-Lac-Pro-R2 (I) で表される化合物。(式中、-Gly-Lac-Pro- は下記式(II)の構造を示し、R1は水素原子、アミド結合で結合したアミノ酸、ポリペプチドまたはヒドロキシカルボン酸、R2は水酸基、アミド結合で結合したアミノ酸もしくはポリペプチド、またはエステル結合で結合したヒドロキシカルボン酸を表す。)【化1】

【請求項2】前記一般式(I)が、X1-X2-Gly-Lac-Pro (X1およびX2はα-アミノ酸残基を示す)である請求項1に記載の化合物。

【請求項3】請求項1または2に記載の化合物を重合させて得られるポリマー。

【請求項4】末端に糖鎖配列、タンパク質、多糖、金属錯体、高分子担体、ゲル、フィルム、ラテックス粒子、金属微粒子、無機微粒子、ガラスプレート、もしくはプラスチックプレートが結合した、請求項1もしくは2に記載の化合物、または請求項3に記載のポリマー。

【請求項5】請求項1もしくは2に記載の化合物または請求項3に記載のポリマーを、水、緩衝液、食塩水、または含水有機溶媒と混合させることにより得られる組成物であって、溶媒和状態、ゲル状態、懸濁物、均一な溶液、または相分離状態を形成する組成物。

【請求項6】加温により水分子を放出し、冷却により水分子を取り込む請求項5に記載の組成物。

【請求項7】請求項1もしくは2に記載の化合物または請求項3に記載のポリマーを含む温度応答性組成物。
  • Applicant
  • ※All designated countries except for US in the data before July 2012
  • NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
  • Inventor
  • OKU, Hiroyuki
  • SHIMODA, Yuya
  • INOUE, Aya
  • TAKAYAMA, Chie
  • YAMADA, Keiichi
  • KATAKAI, Ryoichi
IPC(International Patent Classification)
Specified countries AE(UTILITY MODEL),AG,AL(UTILITY MODEL),AM(PROVISIONAL PATENT)(UTILITY MODEL),AT(UTILITY MODEL),AU,AZ(UTILITY MODEL),BA,BB,BG(UTILITY MODEL),BH,BR(UTILITY MODEL),BW,BY(UTILITY MODEL),BZ(UTILITY MODEL),CA,CH,CN(UTILITY MODEL),CO(UTILITY MODEL),CR(UTILITY MODEL),CU(INVENTOR'S CERTIFICATE),CZ(UTILITY MODEL),DE(UTILITY MODEL),DK(UTILITY MODEL),DM,DO,DZ,EC(UTILITY MODEL),EE(UTILITY MODEL),EG(UTILITY MODEL),ES(UTILITY MODEL),FI(UTILITY MODEL),GB,GD,GE(UTILITY MODEL),GH,GM,GT,HN,HR(CONSENSUAL PATENT),HU(UTILITY MODEL),ID,IL,IN,IS,JP(UTILITY MODEL),KE(UTILITY MODEL),KG(UTILITY MODEL),KM,KN,KP(INVENTOR'S CERTIFICATE)(UTILITY MODEL),KR(UTILITY MODEL),KZ(PROVISIONAL PATENT)(UTILITY MODEL),LA,LC,LK,LR,LS(UTILITY MODEL),LT,LU,LY,MA,MD(UTILITY MODEL),ME,MG,MK,MN,MW,MX(UTILITY MODEL),MY(UTILITY-INNOVATION),MZ(UTILITY MODEL),NA,NG,NI(UTILITY MODEL),NO,NZ,OM,PG,PH(UTILITY MODEL),PL(UTILITY MODEL),PT(UTILITY MODEL),RO,RS(PETTY PATENT),RU(UTILITY MODEL),SC,SD,SE,SG,SK(UTILITY MODEL),SL(UTILITY MODEL),SM,SV,SY,TJ(UTILITY MODEL),TM(PROVISIONAL PATENT),TN,TR(UTILITY MODEL),TT(UTILITY CERTIFICATE),TZ,UA(UTILITY MODEL),UG(UTILITY CERTIFICATE),US,UZ(UTILITY MODEL),VC(UTILITY CERTIFICATE),VN,ZA,ZM,ZW,EP(AT,BE,BG,CH,CY,CZ,DE,DK,EE,ES,FI,FR,GB,GR,HU,IE,IS,IT,LT,LU,LV,MC,MT,NL,PL,PT,RO,SE,SI,SK,TR),OA(BF(UTILITY MODEL),BJ(UTILITY MODEL),CF(UTILITY MODEL),CG(UTILITY MODEL),CI(UTILITY MODEL),CM(UTILITY MODEL),GA(UTILITY MODEL),GN(UTILITY MODEL),GQ(UTILITY MODEL),GW(UTILITY MODEL),ML(UTILITY MODEL),MR(UTILITY MODEL),NE(UTILITY MODEL),SN(UTILITY MODEL),TD(UTILITY MODEL),TG(UTILITY MODEL)),AP(BW,GH,GM,KE,LS,MW,MZ,NA,SD,SL,SZ,TZ,UG,ZM,ZW),EA(AM,AZ,BY,KG,KZ,MD,RU,TJ,TM)
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