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Packaging technique for the fabrication of polarized light emitting diodes achieved

Foreign code F110003769
File No. E06716US2
Posted date Jul 4, 2011
Country United States of America
Application number 27258808
Gazette No. 20090065798
Gazette No. 7723746
Date of filing Nov 17, 2008
Gazette Date Mar 12, 2009
Gazette Date May 25, 2010
Priority data
  • 2005US-60692514 (Jun 21, 2005) US
  • 2006US-11472186 (Jun 21, 2006) US
Title Packaging technique for the fabrication of polarized light emitting diodes achieved
Abstract (US7723746)
A polarized light emitting diode (LED) includes a marker indicating a polarization direction.
A package for the LED also includes a marker indicating the polarization direction.
The markers on the LED and package are used for mutual alignment, wherein the LED is attached in a favorable orientation with respect to a package, so that the polarization direction of emitted light from the package is apparent.
The marker is placed on the LED before die separation and the marker is placed on the package before alignment.
The marker on the LED comprises a photolithographic pattern, an asymmetric die shape, a notch on the die, or a scratch on the die, while the marker on the package comprises an electrode shape or pattern, an asymmetric package shape, a notch on the package, or a scratch on the package.
Finally, the LED or package may be installed in an external circuit or system that also indicates the polarization direction.
Scope of claims [claim1]
1. A polarized light emitting apparatus, comprising: at least one semiconductor device emitting polarized light, wherein the semiconductor device includes at least one first marker indicating a polarization direction for the polarized light emitted by the semiconductor device; and
a package for containing the semiconductor device, wherein the package includes at least one second marker indicating a polarization direction for the polarized light emitted by the semiconductor device when contained within the package, the semiconductor device is positioned within the package by aligning the first marker with the second marker, and the first and second markers are visible.
[claim2]
2. The apparatus of claim 1, wherein the semiconductor device is a light-emitting diode (LED).
[claim3]
3. The apparatus of claim 1, wherein the first marker comprises a photolithographic pattern, an electrode shape or pattern, an asymmetric shape, a notch, or a scratch.
[claim4]
4. The apparatus of claim 1, wherein the second marker comprises an electrode shape or pattern, an asymmetric shape, a notch, or a scratch.
[claim5]
5. The apparatus of claim 1, wherein the package containing the semiconductor device is installed in an external circuit or system that utilizes the light polarization, and the external circuit or system includes at least one third marker indicating a light polarization direction of the external circuit or system, wherein the package is positioned within the external circuit by aligning the second marker with the third marker.
[claim6]
6. The apparatus of claim 1, wherein the first and second markers are visible by naked eye, by microscope observation, by an image recognition system, or by other means.
[claim7]
7. The apparatus of claim 1, wherein the semiconductor device is positioned within the package by aligning the first marker with the second marker during assembly, fabrication, or production without confirming the light polarization of the device or package.
[claim8]
8. A method of fabricating a polarized light emitting apparatus, comprising: obtaining at least one semiconductor device emitting polarized light, wherein the semiconductor device includes at least one first marker indicating a polarization direction for the polarized light emitted by the semiconductor device;
obtaining a package for containing the semiconductor device, wherein the package includes at least one second marker indicating a polarization direction for the polarized light emitted by the semiconductor device when contained within the package; and
positioning the semiconductor device within the package by aligning the first marker with the second marker, wherein the first and second markers are visible.
[claim9]
9. The method of claim 8, wherein the semiconductor device is a light-emitting diode (LED).
[claim10]
10. The method of claim 8, wherein the first marker comprises a photolithographic pattern, an electrode shape or pattern, an asymmetric shape, a notch, or a scratch.
[claim11]
11. The method of claim 8, wherein the second marker comprises an electrode shape or pattern, an asymmetric shape, a notch, or a scratch.
[claim12]
12. The method of claim 8, further comprising installing the package containing the semiconductor device in an external circuit or system that utilizes the light polarization, wherein the external circuit or system includes at least one third marker indicating a light polarization direction of the external circuit or system, and the package is positioned within the external circuit by aligning the second marker with the third marker.
[claim13]
13. The method of claim 8, wherein the first and second markers are visible by naked eye, by microscope observation, by an image recognition system, or by other means.
[claim14]
14. The method of claim 8, wherein the semiconductor device is positioned within the package by aligning the first marker with the second marker during assembly, fabrication, or production without confirming the light polarization of the device or package.
  • Inventor, and Inventor/Applicant
  • MASUI HISASHI
  • NAKAMURA SHUJI
  • DENBAARS STEVEN P
  • JAPAN SCIENCE AND TECHNOLOGY AGENCY
  • UNIVERSITY OF CALIFORNIA
IPC(International Patent Classification)
Reference ( R and D project ) ERATO NAKAMURA Inhomogeneous Crystal AREA
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