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Composite material, method for producing the same, and apparatus for producing the same achieved

Foreign code F110005595
File No. N072-16WO
Posted date Sep 9, 2011
Country United States of America
Application number 99190209
Gazette No. 20110123813
Gazette No. 9028982
Date of filing Mar 2, 2009
Gazette Date May 26, 2011
Gazette Date May 12, 2015
International application number JP2009053871
International publication number WO2010021166
Date of international filing Mar 2, 2009
Date of international publication Feb 25, 2010
Priority data
  • P2008-211184 (Aug 19, 2008) JP
  • 2009WO-JP53871 (Mar 2, 2009) WO
Title Composite material, method for producing the same, and apparatus for producing the same achieved
Abstract (US9028982)
Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced.
A method and an apparatus for producing the composite material are also disclosed.
The method for producing a composite material comprises a dispersion/allocation step wherein the surface of a silicon substrate (102), which is a matrix provided with a silicon layer at least as the outermost layer, is immersed into a first solution containing gold (Au) ions, so that particulate or island-shaped gold (Au) serving as a first metal and substituted with a part of the silicon layer are dispersed/allocated on the matrix surface, and a plating step wherein the silicon substrate (102) is immersed into a second solution (24), which contains a reducing agent to which gold (Au) exhibits catalyst activity and metal ions which can be reduced by the reducing agent, so that the surface of the silicon substrate (102) is covered with the metal or an alloy of the metal (108) which is formed by autocatalytic electroless plating using gold (Au) as a starting point.
Scope of claims [claim1]
1. A composite material comprising: a matrix having a silicon layer as an uppermost layer;
gold particles on a surface of the matrix in shapes of particles or islands, the gold particles displacing part of the silicon layer; and
a metal or an alloy of the metal covering the surface of the matrix, the metal or the alloy of the metal being formed by autocatalytic electroless plating and adhering to the surface with an adhesibility such that the metal or alloy thereof cannot be detached from the surface when tested according to Japanese Industrial Standard test H8504, wherein the gold particles serve as starting points for the autocatalytic electroless plating and wherein the gold particles are catalytically active with respect to a reducing agent employed for the autocatalytic electroless plating.
[claim2]
2. The composite material according to claim 1, wherein the gold particles are dispersed on the surface of the matrix at a particle density ranging from 3 * 1010 particles/cm2 to 1 * 1013 particles/cm2.
[claim3]
3. The composite material according to claim 1, wherein the silicon layer comprises single-crystalline silicon, and the surface of the matrix comprising the gold particles has a root-mean-square roughness (Rq) ranging from 1.1 nm to 1.6 nm.
[claim4]
4. The composite material according to claim 1, wherein the silicon layer comprises a material selected from the group consisting of single-crystalline silicon, polycrystalline silicon, microcrystalline silicon and amorphous silicon.
[claim5]
5. The composite material according to claim 1, wherein the root-mean-square roughness (Rq) of the surface of the matrix comprising the gold particles is increased by an amount ranging from 0.9 nm to 1.5 nm relative to a root-mean-square roughness (Rq) of the surface of the matrix in the absence of the gold particles.
[claim6]
6. A composite material comprising: a matrix having a silicon layer as an uppermost layer;
gold particles on a surface of the matrix in shapes of particles or islands, the gold particles displacing part of the silicon layer; and
a metal or an alloy of the metal covering the surface of the matrix and adhering to the surface with an adhesibility such that the metal or alloy thereof cannot be detached from the surface when tested according to Japanese Industrial Standard test H8504.
[claim7]
7. The composite material according to claim 6, wherein the gold particles are dispersed on the surface of the matrix at a particle density ranging from 3 * 1010 particles/cm2 to 1 * 1013 particles/cm2.
[claim8]
8. The composite material according to claim 6, wherein the silicon layer comprises single-crystalline silicon, and the surface of the matrix comprising the gold particles has a root-mean-square roughness (Rq) ranging from 1.1 nm to 1.6 nm.
[claim9]
9. The composite material according to claim 6, wherein the silicon layer comprises a material selected from the group consisting of single-crystalline silicon, polycrystalline silicon, microcrystalline silicon and amorphous silicon.
[claim10]
10. The composite material according to claim 6, wherein the root-mean-square roughness (Rq) of the surface of the matrix comprising the gold particles is increased by an amount ranging from 0.9 nm to 1.5 nm relative to a root-mean-square roughness (Rq) of the surface of the matrix in the absence of the gold particles.
  • Inventor, and Inventor/Applicant
  • YAE SHINJI
  • HIRANO TATSUYA
  • MATSUDA HITOSHI
  • JAPAN SCIENCE AND TECHNOLOGY AGENCY
IPC(International Patent Classification)
Reference ( R and D project ) CREST Development of Advanced Nanostructured Materials for Energy Conversion and Storage AREA
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