Top > Search of International Patents > Method for reactive ion etching and apparatus therefor

Method for reactive ion etching and apparatus therefor achieved

Foreign code F110005782
File No. Y9803US2
Posted date Sep 14, 2011
Country United States of America
Application number 05924802
Gazette No. 20020079054
Gazette No. 06669807
Date of filing Jan 31, 2002
Gazette Date Jun 27, 2002
Gazette Date Dec 30, 2003
Priority data
  • P1997-256635 (Sep 22, 1997) JP
  • P1997-256636 (Sep 22, 1997) JP
Title Method for reactive ion etching and apparatus therefor achieved
Abstract An apparatus for reactive-ion etching including a reaction vessel and metallic parts disposed in the reaction vessel, the whole or a part of which includes at least one metallic material selected from the group consisting of titanium, aluminum, and an alloy including at least one of them as a main component.
  • Inventor, and Inventor/Applicant
  • Nakatani, Isao; Ibaraki [JP]
  • National Research Institute for Metals, Ibaraki [JP]
  • Japan Science and Technology Corporation, Saitama [JP]
IPC(International Patent Classification)
U.S. Cl./(Sub)
  • 156/345.1
  • 156/345.43
  • 156/345.47
  • 156/345.48
  • 118/723
  • 118/723
Please contact us by E-mail or facsimile if you have any interests on this patent.

PAGE TOP

close
close
close
close
close
close