Top > Search of International Patents > PROCESSING METHOD

PROCESSING METHOD meetings

Foreign code F120006164
File No. 09058PC
Posted date Jan 30, 2012
Country WIPO
International application number 2011JP056597
International publication number WO 2011/118532
Date of international filing Mar 18, 2011
Date of international publication Sep 29, 2011
Priority data
  • P2010-068021 (Mar 24, 2010) JP
Title PROCESSING METHOD meetings
Abstract Disclosed is a processing method which can achieve a high processing rate, and is capable of making a surface smooth. In order to achieve this an SiC substrate (8) is arranged in a potassium hydroxide solution (2) containing hydrogen peroxide, and ultraviolent radiation is irradiated on the surface of the SiC substrate (8). An SiO2 layer (9) is formed on the surface of the SiC substrate (8) due to the irradiation of ultraviolet radiation, and this SiO2 layer (9) is chemically removed by means of the potassium hydroxide solution, and also removed by a synthetic quartz surface plate (3a).
  • Applicant
  • ※All designated countries except for US in the data before July 2012
  • NATIONAL UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY
  • Inventor
  • KUBOTA Akihisa
  • TOUGE Mutsumi
IPC(International Patent Classification)
Please contact us by E-mail or telephone if you have any interests on this patent.

PAGE TOP

close
close
close
close
close
close