Top > Search of International Patents > POROUS STRUCTURE PROVIDED WITH PATTERN THAT IS COMPOSED OF CONDUCTIVE POLYMER, AND METHOD FOR PRODUCING SAME

POROUS STRUCTURE PROVIDED WITH PATTERN THAT IS COMPOSED OF CONDUCTIVE POLYMER, AND METHOD FOR PRODUCING SAME

Foreign code F120006479
File No. S2010-0493-C0
Posted date May 7, 2012
Country WIPO
International application number 2011JP057420
International publication number WO 2011/118800
Date of international filing Mar 25, 2011
Date of international publication Sep 29, 2011
Priority data
  • P2010-073820 (Mar 26, 2010) JP
Title POROUS STRUCTURE PROVIDED WITH PATTERN THAT IS COMPOSED OF CONDUCTIVE POLYMER, AND METHOD FOR PRODUCING SAME
Abstract Disclosed are: a porous structure which is provided with a pattern that is composed of a conductive polymer; and a method for producing the porous structure. Specifically disclosed is a porous structure (1) provided with a pattern that is composed of a conductive polymer, which comprises a porous body (2) and a pattern (3) that is composed of a conductive polymer and arranged on the porous body (2). The porous body (2) is preferably a gel, and a dopant may be added to the pattern (3) that is composed of a conductive polymer. If an agarose gel is used as the gel (2) and a PEDOT electrode (3A) is used as the pattern (3) that is composed of a conductive polymer in the porous structure (1) which is provided with the pattern (3) that is composed of a conductive polymer, the porous structure (1) can be used as an electrode for cell stimulation. The porous structure (1) provided with the pattern (3) that is composed of a conductive polymer can be produced by an electropolymerization method.
  • Applicant
  • ※All designated countries except for US in the data before July 2012
  • TOHOKU UNIVERSITY
  • Inventor
  • NISHIZAWA Matsuhiko
  • SEKINE Soichiro
  • IDO Yuichiro
IPC(International Patent Classification)
Specified countries AE(UTILITY MODEL),AG,AL(UTILITY MODEL),AM(PROVISIONAL PATENT)(UTILITY MODEL),AO(UTILITY MODEL),AT(UTILITY MODEL),AU,AZ(UTILITY MODEL),BA,BB,BG(UTILITY MODEL),BH(UTILITY MODEL),BR(UTILITY MODEL),BW,BY(UTILITY MODEL),BZ(UTILITY MODEL),CA,CH,CL(UTILITY MODEL),CN(UTILITY MODEL),CO(UTILITY MODEL),CR(UTILITY MODEL),CU(INVENTOR'S CERTIFICATE),CZ(UTILITY MODEL),DE(UTILITY MODEL),DK(UTILITY MODEL),DM,DO(UTILITY MODEL),DZ,EC(UTILITY MODEL),EE(UTILITY MODEL),EG(UTILITY MODEL),ES(UTILITY MODEL),FI(UTILITY MODEL),GB,GD,GE(UTILITY MODEL),GH(UTILITY CERTIFICATE),GM,GT(UTILITY MODEL),HN(UTILITY MODEL),HR(CONSENSUAL PATENT),HU(UTILITY MODEL),ID,IL,IN,IS,JP(UTILITY MODEL),KE(UTILITY MODEL),KG(UTILITY MODEL),KM,KN,KP(INVENTOR'S CERTIFICATE)(UTILITY MODEL),KR(UTILITY MODEL),KZ(PROVISIONAL PATENT)(UTILITY MODEL),LA,LC,LK,LR,LS(UTILITY MODEL),LT,LU,LY,MA,MD(UTILITY MODEL),ME,MG,MK,MN,MW,MX(UTILITY MODEL),MY(UTILITY-INNOVATION),MZ(UTILITY MODEL),NA,NG,NI(UTILITY MODEL),NO,NZ,OM(UTILITY MODEL),PE(UTILITY MODEL),PG,PH(UTILITY MODEL),PL(UTILITY MODEL),PT(UTILITY MODEL),RO,RS(PETTY PATENT),RU(UTILITY MODEL),SC,SD,SE,SG,SK(UTILITY MODEL),SL(UTILITY MODEL),SM,ST,SV(UTILITY MODEL),SY,TH(PETTY PATENT),TJ(UTILITY MODEL),TM(PROVISIONAL PATENT),TN,TR(UTILITY MODEL),TT(UTILITY CERTIFICATE),TZ,UA(UTILITY MODEL),UG(UTILITY CERTIFICATE),US,UZ(UTILITY MODEL),VC(UTILITY CERTIFICATE),VN(PATENT FOR UTILITY SOLUTION),ZA,ZM,ZW,EP(AL,AT,BE,BG,CH,CY,CZ,DE,DK,EE,ES,FI,FR,GB,GR,HR,HU,IE,IS,IT,LT,LU,LV,MC,MK,MT,NL,NO,PL,PT,RO,RS,SE,SI,SK,SM,TR),OA(BF(UTILITY MODEL),BJ(UTILITY MODEL),CF(UTILITY MODEL),CG(UTILITY MODEL),CI(UTILITY MODEL),CM(UTILITY MODEL),GA(UTILITY MODEL),GN(UTILITY MODEL),GQ(UTILITY MODEL),GW(UTILITY MODEL),ML(UTILITY MODEL),MR(UTILITY MODEL),NE(UTILITY MODEL),SN(UTILITY MODEL),TD(UTILITY MODEL),TG(UTILITY MODEL)),AP(BW(UTILITY MODEL),GH(UTILITY MODEL),GM(UTILITY MODEL),KE(UTILITY MODEL),LR(UTILITY MODEL),LS(UTILITY MODEL),MW(UTILITY MODEL),MZ(UTILITY MODEL),NA(UTILITY MODEL),SD(UTILITY MODEL),SL(UTILITY MODEL),SZ(UTILITY MODEL),TZ(UTILITY MODEL),UG(UTILITY MODEL),ZM(UTILITY MODEL),ZW(UTILITY MODEL)),EA(AM,AZ,BY,KG,KZ,MD,RU,TJ,TM)
Please contact us by facsimile if you have any interests on this patent.

PAGE TOP

close
close
close
close
close
close