Top > Search of International Patents > Shear measuring method and its device

Shear measuring method and its device

Foreign code F120006708
File No. N051-14CN1
Posted date May 28, 2012
Country China
Application number 201110280838
Gazette No. 102374967
Gazette No. 102374967
Date of filing Sep 27, 2006
Gazette Date Mar 14, 2012
Gazette Date Nov 5, 2014
Priority data
  • P2005-282769 (Sep 28, 2005) JP
  • P2005-282768 (Sep 28, 2005) JP
Title Shear measuring method and its device
Abstract A resonance shear measuring method capable of simple and rapid measurement by obtaining a resonance shear curve through Fourier transformation of a damping curve of an oscillation on one side surface of a sample during measurement of shear response from the sample is provided.
The method is to measure shear response of the sample sandwiched between the solid surfaces of a resonance shear measurement unit along with a change in film thickness by applying an input signal U in to a horizontal driving section of the shear resonance measurement unit, by detecting an oscillation on one side surface of the sample sandwiched between solid surfaces of the resonance shear measurement unit as an output signal U out by means of a displacement gauge, and by applying the output signal U out along with the input signal U in to a resonance shear signal analyzer, wherein a damping curve of the oscillation on one side surface of the sample is Fourier transformed by a Fourier transformation section (5B) to obtain a resonance shear curve.
Also provided is a twin-path type apparatus for shear stress measurement capable of precise measurement of shear stress by using a twin-path method by which a distance between opaque substrates can be measured.
  • Applicant
  • JAPAN SCIENCE AND TECHNOLOGY AGENCY
  • Inventor
  • KURIHARA KAZUE
  • SAKUMA HIROSHI
  • MIZUKAMI MASASHI
IPC(International Patent Classification)
Reference ( R and D project ) CREST Creation of Novel Nano-material/System Synthesized by Self-organization for Medical Use AREA
Please contact us by E-mail or facsimile if you have any interests on this patent.

PAGE TOP

close
close
close
close
close
close