POSITIVE ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING METHOD USING POSITIVE ELECTRODE
| 外国特許コード | F130007273 |
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| 整理番号 | S2011-1118-N0 |
| 掲載日 | 2013年4月5日 |
| 出願国 | 世界知的所有権機関（ＷＩＰＯ） |
| 国際出願番号 | 2012JP072237 |
| 国際公開番号 | WO 2013/038928 |
| 国際出願日 | 平成24年8月31日(2012.8.31) |
| 国際公開日 | 平成25年3月21日(2013.3.21) |
| 優先権データ |
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| 発明の名称 （英語） | POSITIVE ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING METHOD USING POSITIVE ELECTRODE |
| 発明の概要（英語） |
Provided are: a positive electrode for electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein the positive electrode has a lower electric potential, and the electrolysis voltage and basic units of electrical energy can be reduced in comparison to a conventional positive electrode, and which is low-cost and can be used as a positive electrode for electrolytic plating for a variety of types of metals and an electrolytic plating method in which an aqueous solution serves as the electrolytic solution, wherein the electrical potential of the positive electrode and the electrolytic voltage are lower and the basic units of electrical energy can be reduced. This positive electrode for electrolytic plating is used in electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein a catalyst layer comprising amorphous ruthenium oxide and amorphous tantalum oxide has been formed atop an electroconductive substrate. |
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| 国際特許分類(IPC) |
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日本語項目の表示
| 発明の名称 | 電解めっき用陽極および該陽極を用いる電解めっき法 |
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『 POSITIVE ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING METHOD USING POSITIVE ELECTRODE 』に関するお問合せ
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