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POSITIVE ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING METHOD USING POSITIVE ELECTRODE

Foreign code F130007273
File No. S2011-1118-N0
Posted date Apr 5, 2013
Country WIPO
International application number 2012JP072237
International publication number WO 2013/038928
Date of international filing Aug 31, 2012
Date of international publication Mar 21, 2013
Priority data
  • P2011-199258 (Sep 13, 2011) JP
Title POSITIVE ELECTRODE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING METHOD USING POSITIVE ELECTRODE
Abstract

Provided are: a positive electrode for electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein the positive electrode has a lower electric potential, and the electrolysis voltage and basic units of electrical energy can be reduced in comparison to a conventional positive electrode, and which is low-cost and can be used as a positive electrode for electrolytic plating for a variety of types of metals

and an electrolytic plating method in which an aqueous solution serves as the electrolytic solution, wherein the electrical potential of the positive electrode and the electrolytic voltage are lower and the basic units of electrical energy can be reduced. This positive electrode for electrolytic plating is used in electrolytic plating in which an aqueous solution serves as the electrolytic solution, wherein a catalyst layer comprising amorphous ruthenium oxide and amorphous tantalum oxide has been formed atop an electroconductive substrate.

  • Applicant
  • ※All designated countries except for US in the data before July 2012
  • THE DOSHISHA,
  • MORIMITSU MASATSUGU
  • Inventor
  • MORIMITSU MASATSUGU
IPC(International Patent Classification)

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