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SUBSTRATE JOINING METHOD USING RIVET, AND JOINING STRUCTURE meetings

Foreign code F130007318
File No. S2012-1112-N0
Posted date Apr 26, 2013
Country WIPO
International application number 2012JP001424
International publication number WO 2012/117737
Date of international filing Mar 1, 2012
Date of international publication Sep 7, 2012
Priority data
  • P2011-045718 (Mar 2, 2011) JP
Title SUBSTRATE JOINING METHOD USING RIVET, AND JOINING STRUCTURE meetings
Abstract

The present invention makes it possible join substrates by rivet punching in such a manner that peeling and cracking are suppressed. The invention is a method of joining laminated substrates (CFRP) (1, 3) using SPRs (self piercing rivets) (5), with the laminated substrates (CFRP) (1,3) being punched by a rivet axle portion (15) of the SPRs (5), a crimp portion (17) being formed on the end of the rivet axle portion (15), and the laminated substrates (CFRP) (1, 3) being fastened and joined between a rivet head portion (19) and the crimp portion (17) The method is characterized in that metal washers (7, 9) that have inner holes (31) through which the rivet axle portion (15) can pass are stacked on and caused to abut non-joining surfaces (27, 29) of the laminated substrates (CFRP) (1, 3)

the metal washers (7, 9) are used as a jig when punching out

the punching of the rivet axle portion (15) matches the inner holes (31) of the metal washers (7, 9)

and that the joining is performed leaving the respective metal washers (7, 9) between the rivet head portion (19) or crimping portion (17), and the non-joining surfaces (27, 29).

  • Applicant
  • ※All designated countries except for US in the data before July 2012
  • NIHON UNIVERSITY,
  • FUKUI BYORA CO., LTD,
  • UEDA, MASAHITO,
  • HASEGAWA, HIROYUKI,
  • WATANABE, KINYA,
  • FUJII, NAOYA
  • Inventor
  • UEDA, MASAHITO,
  • HASEGAWA, HIROYUKI,
  • WATANABE, KINYA,
  • FUJII, NAOYA
IPC(International Patent Classification)
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