METHOD FOR PRODUCING DIE-PRESSED STRUCTURAL BODY, THIN-FILM TRANSISTOR, THIN-FILM CAPACITOR, ACTUATOR, PIEZOELECTRIC INKJET HEAD, AND OPTICAL DEVICE
This method for producing a die-pressed structural body involves, in the following order: a first step of preparing a liquid material that turns into a metal oxide or a metal by being subjected to a heat treatment
a second step of forming a precursor composition layer made of a precursor composition of said metal oxide or said metal by applying the liquid material onto a base material
a third step of forming, on the precursor composition layer, a die-pressed structure including a residual film by subjecting the precursor composition layer to a die-pressing process by using a die with projections and recesses
a fourth step of treating the residual film by subjecting the precursor composition layer, which has the die-pressed structure formed thereon, to an ashing treatment with an atmospheric-pressure plasma or a reduced-pressure plasma
and a fifth step of forming a die-pressed structural body made of said metal oxide or said metal from the precursor composition layer by subjecting the precursor composition layer to a heat treatment. According to this method for producing a die-pressed structural body, it is possible to produce various functional devices by using significantly smaller amounts of raw materials and production energy compared to conventional art and with fewer steps compared to conventional art.