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This method for producing a functional device involves a die-pressing step and a functional-solid-material layer formation step. In the die-pressing step, a functional-solid-material precursor layer, which employs a functional-solid-material precursor solution as a starting material, is subjected to a die-pressing process in a manner such that, during at least a portion of time within a period in which a die for forming a die-pressed structure is pressed against the functional-solid-material precursor layer, the first temperature of a heat source that supplies heat to the functional-solid-material precursor layer is higher than the second temperature of the functional-solid-material precursor layer. In the functional-solid-material layer formation step, a functional solid material layer is formed from the functional-solid-material precursor layer by subjecting the functional-solid-material precursor layer to a heat treatment at a third temperature that is higher than said first temperature in an oxygen-containing atmosphere after the die-pressing step.
