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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

外国特許コード F170009154
整理番号 (S2016-0332-N0)
掲載日 2017年8月24日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2017JP002652
国際公開番号 WO 2017135132
国際出願日 平成29年1月26日(2017.1.26)
国際公開日 平成29年8月10日(2017.8.10)
優先権データ
  • 特願2016-018817 (2016.2.3) JP
発明の名称 (英語) SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
発明の概要(英語) A semiconductor integrated circuit device in which inductive coupling between coils is improved and supply voltage drops in power supply wires are suppressed as a result of devising a power supply network. The semiconductor integrated circuit device is provided with a power supply network equipped with a first power supply wiring group that passes through the X direction and a second power supply wiring group that passes through the Y direction when viewing the interiors of all of the coils of a first coil array, which is formed in the same horizontal position in a multilayer wiring structure provided on a substrate and comprises a plurality of coils positioned at prescribed intervals, from the lamination direction of the multilayer wiring structure. A closed circuit that surrounds the sides of a coil is formed by at least part of the first power supply wiring group and at least part of the second power supply wiring group.
従来技術、競合技術の概要(英語) BACKGROUND ART
Magnetic field to penetrate the semiconductor chip. Winding a wire on a semiconductor chip made of the transmit coil and the reception coil are disposed close to, the signal transmitted in response to the current flowing through the coil is changed, in accordance with the magnetic field around the coils is changed. At this time, the induced voltage signal to the receiving coil, to recover the signal through the receiving circuit. Such, data communication using the inductive coupling between the stacked chip of a digital signal used in the connection.
Is performing data communication using inductive coupling, the through silicon vias (TSV) having a laminated inter-chip connection such as compared to the conventional mechanical connection, since the electronic circuit connected to the integrated, the manufacturing yield is high is the advantage that the cost is low. In addition, the electromagnetic field signal is provided penetrating the semiconductor substrate since the transistor can be less restricted by the place of connection between the coils at a high speed communication channel can be increased or an electrostatic protection circuit is not required to be low-power advantages.
However, when the metal plate in the vicinity of the coil, the electromagnetic induction effect to compensate for the change in the magnetic field by the eddy induction current in the metal (eddy current) occurs, as a result of the inductive coupling between the coil is weakened. The smaller the resistance of the metal plate becomes large and the change of the eddy current, a magnetic field stronger the force that cancels a change.
The semiconductor chip of the transceiver since the air-core coil is provided, the change of the magnetic field generated at the periphery of the coil side increases. Therefore, when the metal plate in the vicinity of the coil, the coil sides of coil side in the vicinity of the eddy current to flow along the closed path can be. The lower the electrical resistance of the path, the weaker the inductive coupling is expected.
On the other hand, the semiconductor chip has a power supply wiring often installed on the network. The power supply voltage drop in the power supply wiring in order to suppress the electrical resistance may be set, therefore, low resistance power supply network and the details provided. In this way the inductive coupling coil and the power supply network, the power supply voltage drop to improve the degradation of the inductive coupling of the coil, induction of a coil and a power supply voltage drop and to improve coupling and the deterioration of the relationship between the contradictory requirements, it is possible to achieve both requirements is important.
Therefore, the inventors of the present invention, a detailed investigation is performed by electromagnetic field simulation, the test chip further design, test, are measured, the electric resistance of the power supply network and the inductive coupling between the coil and as a result of earnest the relationship between the sought (for example, Non-Patent Document 1 and non-patent reference 2).
Non-Patent Document 1 or Non-Patent Document 2 as shown, an eddy current along the coil side closed circuit flows through the inductive coupling is considerably reduced, eddy current does not flow through the closed circuit is not a little decrease in the inductive coupling was confirmed. In addition, as shown in Fig. 28, according to the experimental results using the test chip, the eddy current flows in closed circuit arranged farther away from the coil side, to recover the strength of the inductive coupling was confirmed. Incidentally, reference numeral Z is in the drawing, an interval of the transmission coil and receiving coil.
Fig. 28 is, a closed circuit of inductive coupling and eddy current flows through the coil the space between the coil side and the side-length of the X D of the present invention in dependence on the ratio. As shown in Fig. 28, an eddy current to flow along the coil side and the (X/D=0), about 20% (about 1/5) the degree of inductive coupling decreases. On the other hand, one side of the coil from the coil side 0.5 at a distance D of twice the length of the eddy current flows through the (X/D=0. 5), the degree of inductive coupling (about 1/2) to about 50% can be seen to recover.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • KEIO UNIVERSITY
  • 発明者(英語)
  • KURODA, Tadahiro
国際特許分類(IPC)
指定国 National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
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