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VASCULAR SAP MEASUREMENT SENSOR AND PRODUCTION METHOD FOR VASCULAR SAP MEASUREMENT SENSOR NEW

外国特許コード F180009448
整理番号 (S2017-0032-N0)
掲載日 2018年7月24日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2017JP035407
国際公開番号 WO 2018079186
国際出願日 平成29年9月29日(2017.9.29)
国際公開日 平成30年5月3日(2018.5.3)
優先権データ
  • 特願2016-210239 (2016.10.27) JP
発明の名称 (英語) VASCULAR SAP MEASUREMENT SENSOR AND PRODUCTION METHOD FOR VASCULAR SAP MEASUREMENT SENSOR NEW
発明の概要(英語) The present invention provides a vascular sap measurement sensor in which a flow channel into which vascular sap flows is less susceptible to becoming blocked with plant tissue. This vascular sap measurement sensor (1) is provided with a collection probe (20) for collecting vascular sap, and a support part (10) for supporting the collection probe (20). The collection probe (20) has formed therein a collection flow channel (21) into which vascular sap flows, and an entrance opening (24) to the collection flow channel (21) is formed in a lateral surface of the collection probe (20). Due to this configuration, when the collection probe (20) is used to pierce a plant, the collection flow channel (21) is unlikely to become blocked with plant tissue.
特許請求の範囲(英語) [claim1]
1. Vascular probe for collecting liquid, and a supporting portion which supports the trapping probe, and, the trapping located within the probe vascular fluid flows into the flow channel is formed and collected, the collection of the flow passage inlet openings are arranged on the side surfaces of the trapping probe and the vascular fluid measurement sensor.
[claim2]
2. A collection channel inlet has an opening through one of 2, wherein the entrance aperture of one of the trapping is disposed on one side of the probe, and the other of the inlet openings are arranged on the other side of the collecting probe to the vascular fluid according to claim 1 characterized in that the measurement sensor.
[claim3]
3. Wherein the flow path is the collector, at least one pro-2 unit is connected to the inlet openings, the trapping probe in a direction along the width of the second flow path 1, with one end connected to the first flow path 1, the trapping probe formed along the axial direction of the second flow path 2, and, wherein the first flow path in the interior of the 1, wherein the flowed from the inlet opening to the first flow path 2 vascular fluid is guided to the guide wall is provided with the vascular fluid according to claim 2 characterized in that the measurement sensor.
[claim4]
4. 1 A collection channel has one entry opening, said inlet openings are arranged on one side of the collecting probe to the vascular fluid according to claim 1 characterized in that the measurement sensor.
[claim5]
5. The trapping in the flow passage is provided with a pH-measuring device as claimed in claim 1, 2, 3 or 4 wherein the vascular fluid measurement sensor.
[claim6]
6. On which the electrodes for measuring the electrical resistance of the electrical resistance is provided having a probe, said electrically resistive probe is supported on the support portion, is located within the probe to the electric resistance vascular fluid flows into the flow path forming substrate and the electrode, the electrode probe to the electric resistance of the flow path is formed along the width direction, said electrode opening of a flow passage is arranged on the side surface of the probe to the electric resistance and, wherein the electrode in the flow passage is provided with the electrodes for measuring the electrical resistance as claimed in claim 1, 2, 3, 4 vascular liquid 5 or of the measurement sensor.
[claim7]
7. Wherein the electrical resistance probe has a plurality of said electrode and the flow path, the flow path for a plurality of said electrode, said electrically resistive probe disposed juxtaposed in the axial direction, a plurality of said electrode flow path to each of the electrodes for measuring the electric resistance and provided according to claim 6 vascular fluid measurement sensor.
[claim8]
8. The heater and a temperature sensor provided with a heater and a temperature probe, and a temperature probe temperature sensor is provided, is provided, with the heater temperature probe and said temperature probe is supported by the support portion to claim 1, vascular liquid 2, 3, 4, 5, 6 7 or of the measurement sensor.
[claim9]
9. Wherein the temperature of the heater is located within the probe with the vascular fluid flows into the flow path forming substrate and a temperature sensor and, a temperature sensor and the flow path of the temperature probe with a heater formed along the width direction, wherein the opening of a flow passage and a temperature sensor circuit is disposed on a side face of the temperature probe with a heater and, wherein the temperature sensor in the flow passage is provided by the temperature sensor and a measurement sensor according to claim 8 vascular fluid.
[claim10]
10. Wherein the vascular bundle is located within the probe temperature will flow into the flow path forming substrate and a temperature sensor and, a temperature sensor and said flow path is formed along the direction of the width of the temperature probe and, opening of a flow passage for a temperature sensor and said temperature probe is disposed on the side surface of, wherein the temperature sensor in the flow passage is provided with a temperature sensor and a measurement sensor of claims 8 or 9 vascular fluid.
[claim11]
11. The support portion includes, on the insulating substrate and a semiconductor substrate and formed of a stacked structure, the heater with a temperature probe and said temperature probe is formed in the side of the semiconductor substrate and, wherein the temperature of the support section supports said probe portion and with the heater, the temperature probe between the support portion, the semiconductor substrate has been removed by the formation of the groove claim 8 characterized in that, wherein the 9 or 10 vascular fluid measurement sensor.
[claim12]
12. A temperature sensor and a heater is provided with a heater and a temperature probe, the temperature sensor is provided with a temperature probe, said temperature probe and the heater with a temperature probe and a supporting section, and, in the inside of the heater temperature probe with vascular fluid flows into the flow path forming substrate and a temperature sensor and, a temperature sensor and the heater is a flow path extending in a direction along the width of the temperature probe with and, wherein the opening of the flow path and a temperature sensor circuit is disposed on a side face of the probe with the heater and the temperature, the temperature sensor in the flow passage is provided with a temperature sensor and a measurement sensor for measuring liquid vascular bundle.
[claim13]
13. Wherein the vascular bundle is located within the probe temperature will flow into the flow path forming substrate and a temperature sensor and, a temperature sensor and said flow path is formed along the direction of the width of the temperature probe and, opening of a flow passage for a temperature sensor and said temperature probe is disposed on the side surface of, wherein the temperature sensor in the flow passage is provided by the temperature sensor and a measurement sensor according to claim 12 vascular fluid.
[claim14]
14. A temperature sensor and a heater is provided with a heater and a temperature probe, a temperature sensor which is provided with a temperature probe, said temperature probe and the heater with a temperature probe and a supporting section, is provided, is located within the probe temperature vascular fluid flows into the flow path forming substrate and a temperature sensor and, a temperature sensor and said flow path is formed along the width direction of the temperature probe and, wherein the opening of a flow passage and a temperature sensor circuit is disposed on a side face of the temperature probe and, the temperature sensor in the flow passage is provided by the temperature sensor and a measurement sensor for measuring liquid vascular bundle.
[claim15]
15. Wherein the support portion, the insulating substrate and the semiconductor substrate and formed of a stacked structure, with the heater temperature probe and the temperature probe is formed in the side of the semiconductor substrate and, wherein the temperature of the support section supports said probe portion and with the heater, the temperature probe between the supporting portion, the semiconductor substrate is removed with grooves formed in claim 12 characterized in that, 13 or 14 wherein the vascular liquid measurement sensor.
[claim16]
16. On which the electrodes for measuring the electrical resistance of the electrical resistance is provided having a probe, said electrically resistive probe is supported on the support portion, is located within the probe to the electric resistance vascular fluid flows into the flow path forming substrate and the electrode, the electrode probe to the electric resistance of the flow path is formed along the width direction, said electrode opening of a flow passage is arranged on the side surface of the probe to the electric resistance and, wherein said electrically resistive flow passage for an electrode of the electrode is provided for measuring as claimed in claim 12, 13, 14 or 15 wherein the vascular fluid measurement sensor.
[claim17]
17. A plurality of said electrode probe to the electric resistance has a flow path, a plurality of said electrode flow path, the axis of the probe to the electric resistance are arranged in a row direction and, for each of a plurality of said electrode for measuring the electric resistance to the flow path is provided with the electrode according to claim 16 and vascular fluid measurement sensor.
[claim18]
18. Vascular fluid flows into the collector comprising a probe having a flow passage Printac vascular measurement sensor manufacturing method of a liquid, the semiconductor substrate, the inlet opening is located on a side of the collecting probe and wherein the side wall to form the sidewalls of the channel is collected and the step of forming, the upper end of the side wall of the photoresist to form of a sheet and fused bridged, wherein the photoresist layer to remove an unnecessary portion of the collection of the flow path forming step to form the ceiling portion of the ceiling, a vascular characterized in that the measurement sensor manufacturing method of the liquid.
[claim19]
19. Wherein the side wall forming step, a sheet-shaped heat-sealed with a photoresist, the photoresist of the portion corresponding to the flow path Printac removed to form side walls of the vascular bundle according to claim 18 characterized in that the measurement sensor manufacturing method of the liquid.
[claim20]
20. Wherein the side wall forming step, the trapping of the semiconductor substrate to remove a portion corresponding to the flow path to form the sidewalls wherein said measurement sensor manufacturing method according to claim 18 vascular fluid.
[claim21]
21. Wherein the side wall after said side wall forming step comprising the steps of hydrophilic hydrophilizing characterized in that the measurement sensor manufacturing method according to claim 18 vascular fluid.
[claim22]
22. And after the formation step to said ceiling and the trapping in the flow passage comprises hydrophilic hydrophilizing characterized in that the method of manufacturing according to claim 18 vascular fluid measurement sensor.
[claim23]
23. A temperature sensor circuit vascular fluid flows into the flow path of the temperature probe with a heater having a vascular solution comprises a method of manufacturing the measuring sensors, on the semiconductor substrate, the inlet opening is arranged on the side surface of the temperature probe with the heater and the temperature sensor and the flow path to form the sidewalls of the step of forming the side wall, the upper end of the side wall of the photoresist to form of a sheet is heat-sealed and bridged, wherein the unnecessary portions of the photoresist is removed to a ceiling of an inner flow path and a temperature sensor circuit a ceiling forming step, characterized in that it comprises the method of manufacturing the vascular bundle and a measurement sensor for measuring liquid.
[claim24]
24. In the step of forming said side wall, the form of a sheet is heat-sealed and photoresist, the photoresist of the portion corresponding to the flow path and a temperature sensor circuit is removed to form the sidewalls wherein said measurement sensor manufacturing method according to claim 23 vascular fluid.
[claim25]
25. In the step of forming said side wall, and a temperature sensor circuit of the semiconductor substrate to remove a portion corresponding to the flow path to form the sidewalls wherein said measurement sensor manufacturing method according to claim 23 vascular fluid.
[claim26]
26. Wherein the side wall after said side wall forming step comprising the steps of hydrophilic hydrophilizing characterized in that the measurement sensor manufacturing method according to claim 23 vascular fluid.
[claim27]
27. And after the formation step to said ceiling and a temperature sensor and said flow path through the interior of the hydrophilic hydrophilic characterized in comprising the steps of the method of manufacturing according to claim 23 vascular fluid measurement sensor.
[claim28]
28. Vascular fluid flows into the temperature sensor comprises a temperature probe having a flow passage for the vascular bundle measurement sensor manufacturing method of a liquid, the semiconductor substrate, wherein the inlet opening is disposed on a side face of the temperature probe for a temperature sensor and said flow path and the side walls of the side wall forming step, the form of a sheet on an upper end of the sidewall of the photoresist is bridged and fused, wherein the photoresist layer to remove an unnecessary portion of the temperature sensor and the flow path forming step to form the ceiling portion of the ceiling, a vascular characterized in that the measurement sensor manufacturing method of the liquid.
[claim29]
29. In the step of forming said side wall, the form of a sheet is heat-sealed and photoresist, the photoresist of the portion corresponding to the flow path for a temperature sensor and said removing to form the sidewalls wherein said method of manufacturing according to claim 28 vascular fluid measurement sensor.
[claim30]
30. In the step of forming said side wall, and a temperature sensor circuit of the semiconductor substrate corresponding to the flow path portions are removed to form the sidewalls wherein characterized in that the manufacturing method according to claim 28 vascular fluid measuring sensors.
[claim31]
31. And after the formation step of the side wall and said side wall comprising the steps of hydrophilic hydrophilizing characterized in that the method of manufacturing according to claim 28 vascular fluid measurement sensor.
[claim32]
32. And after the formation step to said ceiling and a temperature sensor and said flow path through the interior of the hydrophilic hydrophilic characterized in comprising the steps of the method of manufacturing according to claim 28 vascular fluid measurement sensor.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • KAGAWA UNIVERSITY
  • 発明者(英語)
  • SHIMOKAWA FUSAO
  • ONO AKIHITO
  • TAKAO HIDEKUNI
  • TERAO KYOHEI
  • KOBAYASHI TSUYOSHI
  • KATAOKA IKUO
国際特許分類(IPC)
指定国 (WO201879186)
National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO JP KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG

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