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Processing device for metal material NEW コモンズ

外国特許コード F180009587
整理番号 2017000348
掲載日 2018年11月7日
出願国 中華人民共和国
出願番号 201580043271
公報番号 107148323
出願日 平成27年8月11日(2015.8.11)
公報発行日 平成29年9月8日(2017.9.8)
国際出願番号 JP2015072754
国際公開番号 WO2016024586
国際出願日 平成27年8月11日(2015.8.11)
国際公開日 平成28年2月18日(2016.2.18)
優先権データ
  • 特願2014-165032 (2014.8.13) JP
  • JP2015072754 (2015.8.11) WO
発明の名称 (英語) Processing device for metal material NEW コモンズ
発明の概要(英語) Provided is a processing device for a metal material, the device comprising: an airtight container that holds a sample therewithin; an oxygen pump that extracts oxygen molecules from a gas discharged from the airtight container; a circulation means that returns the gas to the airtight container; and a plasma generation means that converts the gas returned from the circulation means into plasma and irradiates the sample with the same.
従来技術、競合技術の概要(英語) Background Art
A general method for the industry to form a circuit, formed on one side of the back plate of a metal insulator semiconductor · · an electronic material film is processed through a photolithography method.In other words, the photoresist is coated on the film, developing · through exposure, the circuit remains necessary portions of the photoresist, etching away unwanted electronic material through, the remaining photoresist is also removed, the operation is repeated.In this way, a large number of electronic material becomes obsolete, since the electronic material of the photoresist · waste liquid treatment, a step of burden on the environment has to be as high.
Therefore, in recent years, use of a printed circuit forming method is used as the necessary material can be disposed in the necessary location techniques, from the viewpoint of resource saving and energy-saving, have been attracting attention.
Thus, for forming a wiring in the circuit for the part, an ink or a paste containing the metal particles may be used, inkjet or screen printing method or the like through various printing method, a wiring pattern formed on the substrate.Since the ink or paste is a liquid, in addition to other than the metal fine particles containing a solvent, to prevent the aggregation of the fine metal particles will generally also contain a dispersing agent, an adhesive for securing adhesion to the substrate, the organic solvent or the like for adjusting the viscosity of liquids.Thus, after the formation of the wiring pattern, it is necessary to decompose the organics through heat treatment, the conductive path is formed between the metal fine particles.As a substrate to be printed, preferably a flexible resin, in view from the heat-resistant temperature limits, is desirable to reduce the heat treatment temperature (for example not more than about 200 °C).
For example, as a heat-resistant resin, the polyimide (260 °C or more may be used).However, more expensive than with other resins.Therefore, to be able to use less expensive resins, such as a naphthalene dicarboxylic acid ethylene glycol (PEN, upper use temperature of about 180 °C), polyethylene terephthalate (PET, upper use temperature of about 120 °C), it is desirable to the heat treatment temperature was lowered to 180 °C or less, preferably 120 °C or less.
For containing an ink or paste fine particles of silver as a metal, a low temperature through a heat treatment was performed in air, exhibit a good development of various conductive article (Patent Document 1).On the other hand, in the case of containing copper, the heat treatment is carried out in the air atmosphere, resulting in formation of copper oxide as an insulator, a conductive wiring cannot be obtained.In order to avoid this problem, there is a need in the calcination processing, through some means to at least partially the periphery of the copper particles becomes a reducing atmosphere.
As a measure, there is known a method:
In a hydrogen (1) (Non-Patent Document 1), formic acid vapor (Patent Document 2), a very low oxygen atmosphere (Patent Document 3, Patent Document 4, Non-Patent Document 2) and the like some kind of heat treatment in a reducing gas,
Use of copper formate (2) and the like from the ink composition creation of a reductive gas through thermal decomposition of the ink, a heat treatment on the basis of shutting off oxygen in the (non-Patent Document 3, Patent Document 5).
Prior Art Document
Patent Document
Patent Document 1: JP-A-2012-144795
Patent Document 2: JP-A- 2013-80919 A
Patent Document 3: Patent Specification No.No.3921520
Patent Document 4: Patent Specification No.No.4621888
Patent Document 5: International Publication Pamphlet No. 2013/073349
Non-Patent Document
Non-Patent Document 1: Thin Solid Films 520 (2012) 2789
Non-Patent Document 2: JPn.J.Appl.Phys.52 (2013) 05DB19
Non-Patent Document 3: Mater.Res.Bull.47 (2012) 4107
特許請求の範囲(英語) [claim1]
1. Of the metal material processing apparatus, having:
Sample contained inside a sealed container,
Exhaust gas is discharged from the sealed container of oxygen molecules by the oxygen pump,
The gas is returned to the closed container circulation means, and
Is in the closed container, that is configured returned by the gas from the plasma, irradiation of the sample into plasma device.
[claim2]
2. Of the metal material processing apparatus, having:
Sample contained inside a sealed container,
Exhaust gas is discharged from the sealed container of oxygen molecules by the oxygen pump,
The gas is returned to the closed container circulation means,
The recirculating means returned by the gas from the heat of the heater, and
Is in the closed container, that is configured returned by the gas from the plasma, irradiation of the sample into plasma device.
[claim3]
3. Claim 1 or 2 device, wherein, in the closed container for holding a sample having a sample table.
[claim4]
4. Apparatus according to claim 3, wherein, the sample stage is provided with a heater to heat the sample.
[claim5]
5. Claim 1-4 any one device, wherein, the gas discharged from the circulation means is returned to the closed vessel is pressurized sealed vessel.
[claim6]
6. Claim 1-5 any one device, wherein, the metal material is a metal or metal compound particles.
[claim7]
7. Claim 1-6 any one device, which is capable of performing sintering and reduction of a metal material, or sintered or reduced.
[claim8]
8. Claim 1-7 any one device, wherein, the gas plasma is generated from coming back from the circulation device by a total pressure of 0.1 atm or more and less than absolute pressure ranging from 10 atm.
[claim9]
9. Claim 1-8 any one device, wherein, the metal material constituting the metal is copper.
[claim10]
10. Claim 1-9 any one device, wherein, the gas containing nitrogen.
[claim11]
11. Claim 1-10 any one device, wherein, in the closed container is returned to the gas in the oxygen partial pressure of 10-25 -atmospheric pressure.
[claim12]
12. Claim 1-11 any one device, wherein, the oxygen pump is provided with the solid electrolyte body having oxygen ion conductivity and disposed on its inside and outside of the electrode.
[claim13]
13. Apparatus according to claim 12, wherein, as a stabilized zirconia solid electrolyte body.
[claim14]
14. Claim 12 or 13 device, wherein, electrode is provided on a surface of the solid electrolyte body along the porous electrode.
  • 出願人(英語)
  • NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST
  • 発明者(英語)
  • SHIRAKAWA NAOKI
  • MURATA KAZUHIRO
国際特許分類(IPC)
参考情報 (研究プロジェクト等) Flexible Electronics Research Center, AIST

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