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THERMAL EXPANSION SUPPRESSING MEMBER AND ANTI-THERMALLY-EXPANSIVE MEMBER

Foreign code F180009598
File No. 3070
Posted date Nov 16, 2018
Country United States of America
Application number 201113205272
Gazette No. 20120040196
Gazette No. 8753749
Date of filing Aug 8, 2011
Gazette Date Feb 16, 2012
Gazette Date Jun 17, 2014
Priority data
  • P2010-180885 (Aug 10, 2010) JP
  • P2011-097851 (Apr 26, 2011) JP
Title THERMAL EXPANSION SUPPRESSING MEMBER AND ANTI-THERMALLY-EXPANSIVE MEMBER
Abstract Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20°C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (Bi1-xMx)NiO3 (1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≤x≤0.15.
  • Inventor, and Inventor/Applicant
  • Kubota; Makoto
  • Miura; Kaoru
  • Yabuta; Hisato
  • Matsumura; Yoshihiko
  • Shimakawa; Yuichi
  • Azuma; Masaki
  • Canon Inc.
  • Kyoto University
IPC(International Patent Classification)
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