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METHOD FOR PRODUCING PLATED MOLDED BODY, AND PLATED MOLDED BODY UPDATE

外国特許コード F180009615
整理番号 5501
掲載日 2018年11月19日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2017JP045758
国際公開番号 WO 2018117160
国際出願日 平成29年12月20日(2017.12.20)
国際公開日 平成30年6月28日(2018.6.28)
優先権データ
  • 特願2016-248781 (2016.12.22) JP
発明の名称 (英語) METHOD FOR PRODUCING PLATED MOLDED BODY, AND PLATED MOLDED BODY UPDATE
発明の概要(英語) Provided is a method for producing a plated molded body, which forms an electroless plating film on a molded body having high plating reactivity by a low-cost method that places only a little burden on the environment. This method for producing a plated molded body comprises: a process for obtaining a molded body by molding a thermoplastic resin that contains cellulose nanofibers; a process for bringing an electroless plating catalyst liquid that contains a metal salt into contact with the molded body; and a process for forming an electroless plating film on the surface of the molded body by bringing an electroless plating liquid into contact with the molded body, which has been brought into contact with the electroless plating catalyst liquid.
従来技術、競合技術の概要(英語) BACKGROUND ART
At a low cost molded body as the method of forming a metal film, the electroless plating have been known.In electroless plating, the adhesion of the metal film for ensuring the strength of the molded body, hexavalent chromium or permanganic acid may be used an etching solution containing an oxidizing agent such as roughening of the surface of the molded pre-processing is performed.Therefore, the electroless plating, from being eroded by etching solution at the ABS resin (acrylonitrile, butadiene, styrene copolymer synthetic resin) have been mainly used.ABS resin, rubber component selectively eroded by an etching solution, an uneven surface is formed.On the other hand, of a resin other than ABS, for example, polycarbonate or the like, in order to allow electroless plating, such as ABS resin or elastomer, is selectively oxidized in the etching solution in a plating grade is mixed with a commercially available.However, in such an electroless plating pretreatment, can be used as the hexavalent chromium acid, is the problem of high environmental load.
Roughening the surface of the molded body, an electroless plating catalyst is applied, then, electroless plating is performed.Is applied to a plastic substrate as an electroless plating catalyst, 2 is mainly two methods is used.Tin colloid adsorbed to the substrate (sensitizer) and then, immersed in a palladium chloride solution (activator), palladium chloride and stannous chloride precipitated in the reduction of the sensitizer, activator method, after a palladium tin colloid adsorbed to the substrate (catalyst), such as concentrated sulfuric acid by reduction of the catalyst (accelerator), accelerator method.Sensitizer, activator method, the tin bath of sensitizer used in the life is short, there is a problem that productivity is low.For this reason, industrial electroless plating catalyst as the method of, mainly, catalyst, and the accelerator are adopted.
On the other hand, before the electroless plating of the improved processing method has been proposed.For example, in Patent Document 1, in order to reduce the number of steps in the plating pre-treatment, an etchant containing hydrochloric acid and an inorganic acid, such as palladium ions ionogen active agents, organic acid such as acetic and a method for treating a molded body in one solution has been proposed.According to Patent Document 1, one of the above-described solution in the pre-conditioning, an environmental load is large and hexavalent chromium is not necessary to use acid and the like, a good plating film can be obtained.In addition, in Patent Document 2, sensitizer, activator used in the method, a palladium-tin colloid solution containing the sensitizer as an alternative, palladium ions 2-amino ethyl pyridine complexes of an electroless plating catalyst has been proposed.Is a conventional sensitizer solution, a high environmental load includes tin, in addition, a palladium-tin colloid is easily aggregates had a problem.According to Patent Document 2, an electroless plating catalyst liquid is proposed, a high environmental load does not contain tin, further, as compared to a conventional sensitizer solution is stable for a long time.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • MAXELL HOLDINGS, LTD.
  • KYOTO UNIVERSITY
  • 発明者(英語)
  • YUSA, Atsushi
  • YAMAMOTO, Satoshi
  • MITO, Koichi
  • YAMAGUCHI, Yasuo
  • OHSHIMA, Masahiro
国際特許分類(IPC)
指定国 National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
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