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METHOD FOR PRODUCING PLATED MOLDED BODY, AND PLATED MOLDED BODY

Foreign code F180009615
File No. 5501
Posted date Nov 19, 2018
Country WIPO
International application number 2017JP045758
International publication number WO 2018117160
Date of international filing Dec 20, 2017
Date of international publication Jun 28, 2018
Priority data
  • P2016-248781 (Dec 22, 2016) JP
Title METHOD FOR PRODUCING PLATED MOLDED BODY, AND PLATED MOLDED BODY
Abstract Provided is a method for producing a plated molded body, which forms an electroless plating film on a molded body having high plating reactivity by a low-cost method that places only a little burden on the environment. This method for producing a plated molded body comprises: a process for obtaining a molded body by molding a thermoplastic resin that contains cellulose nanofibers; a process for bringing an electroless plating catalyst liquid that contains a metal salt into contact with the molded body; and a process for forming an electroless plating film on the surface of the molded body by bringing an electroless plating liquid into contact with the molded body, which has been brought into contact with the electroless plating catalyst liquid.
Outline of related art and contending technology BACKGROUND ART
At a low cost molded body as the method of forming a metal film, the electroless plating have been known.In electroless plating, the adhesion of the metal film for ensuring the strength of the molded body, hexavalent chromium or permanganic acid may be used an etching solution containing an oxidizing agent such as roughening of the surface of the molded pre-processing is performed.Therefore, the electroless plating, from being eroded by etching solution at the ABS resin (acrylonitrile, butadiene, styrene copolymer synthetic resin) have been mainly used.ABS resin, rubber component selectively eroded by an etching solution, an uneven surface is formed.On the other hand, of a resin other than ABS, for example, polycarbonate or the like, in order to allow electroless plating, such as ABS resin or elastomer, is selectively oxidized in the etching solution in a plating grade is mixed with a commercially available.However, in such an electroless plating pretreatment, can be used as the hexavalent chromium acid, is the problem of high environmental load.
Roughening the surface of the molded body, an electroless plating catalyst is applied, then, electroless plating is performed.Is applied to a plastic substrate as an electroless plating catalyst, 2 is mainly two methods is used.Tin colloid adsorbed to the substrate (sensitizer) and then, immersed in a palladium chloride solution (activator), palladium chloride and stannous chloride precipitated in the reduction of the sensitizer, activator method, after a palladium tin colloid adsorbed to the substrate (catalyst), such as concentrated sulfuric acid by reduction of the catalyst (accelerator), accelerator method.Sensitizer, activator method, the tin bath of sensitizer used in the life is short, there is a problem that productivity is low.For this reason, industrial electroless plating catalyst as the method of, mainly, catalyst, and the accelerator are adopted.
On the other hand, before the electroless plating of the improved processing method has been proposed.For example, in Patent Document 1, in order to reduce the number of steps in the plating pre-treatment, an etchant containing hydrochloric acid and an inorganic acid, such as palladium ions ionogen active agents, organic acid such as acetic and a method for treating a molded body in one solution has been proposed.According to Patent Document 1, one of the above-described solution in the pre-conditioning, an environmental load is large and hexavalent chromium is not necessary to use acid and the like, a good plating film can be obtained.In addition, in Patent Document 2, sensitizer, activator used in the method, a palladium-tin colloid solution containing the sensitizer as an alternative, palladium ions 2-amino ethyl pyridine complexes of an electroless plating catalyst has been proposed.Is a conventional sensitizer solution, a high environmental load includes tin, in addition, a palladium-tin colloid is easily aggregates had a problem.According to Patent Document 2, an electroless plating catalyst liquid is proposed, a high environmental load does not contain tin, further, as compared to a conventional sensitizer solution is stable for a long time.
Scope of claims (In Japanese)請求の範囲 [請求項1]
 メッキ成形体の製造方法であって、
 セルロースナノファイバーを含む熱可塑性樹脂を成形して、成形体を得ることと、
 前記成形体に金属塩を含む無電解メッキ触媒液を接触させることと、
 前記無電解メッキ触媒液を接触させた前記成形体に、無電解メッキ液を接触させて、前記成形体の表面に無電解メッキ膜を形成することとを含む製造方法。

[請求項2]
 前記成形体を前記無電解メッキ触媒液に接触させる前に、前記成形体に膨潤処理、又はエッチング処理を施すことを更に含む請求項1に記載の製造方法。

[請求項3]
 前記無電解メッキ触媒液に含まれる金属塩が、塩化パラジウム、塩化銀、塩化銅、及び硝酸銀からなる群から選択される1つであることを特徴とする請求項1又は2に記載の製造方法。

[請求項4]
 前記熱可塑性樹脂が、ポリアミド、ポリプロピレン、又はABS樹脂を含むことを特徴とする請求項1~3のいずれか一項に記載の製造方法。

[請求項5]
 前記成形体を成形することが、
 前記熱可塑性樹脂と、前記セルロースナノファイバーとを含む樹脂ペレットを用意することと、
 前記樹脂ペレットを成形して、前記成形体を得ることとを含む請求項1~4のいずれか一項に記載の製造方法。

[請求項6]
 前記樹脂ペレットを用意することが、
 前記熱可塑性樹脂を可塑化溶融した溶融樹脂と、前記セルロースナノファイバーが溶媒に分散したスラリーとの混合物を得ることと、
 前記混合物から、前記溶媒を除去することと、
 前記溶媒を除去した前記混合物を押出成形して、押出成形体を得ることと、
 前記押出成形体を粉砕して、前記樹脂ペレットを得ることとを含む請求項5に記載の製造方法。

[請求項7]
 前記樹脂ペレットを用意することが、
 前記溶融樹脂と前記スラリーとの前記混合物に、水を加えることを更に含む請求項6に記載の製造方法。

[請求項8]
 メッキ成形体であって、
 熱可塑性樹脂と、セルロースナノファイバーとを含む成形体と、
 前記成形体の表面に形成された無電解メッキ膜とを含むメッキ成形体。

[請求項9]
 前記成形体が、内部に発泡セルを有する発泡成形体であることを特徴とする請求項8に記載のメッキ成形体。

[請求項10]
 前記熱可塑性樹脂が、ポリアミド、ポリプロピレン、又はABS樹脂を含むことを特徴とする請求項8又は9に記載のメッキ成形体。

  • Applicant
  • ※All designated countries except for US in the data before July 2012
  • MAXELL HOLDINGS, LTD.
  • KYOTO UNIVERSITY
  • Inventor
  • YUSA, Atsushi
  • YAMAMOTO, Satoshi
  • MITO, Koichi
  • YAMAGUCHI, Yasuo
  • OHSHIMA, Masahiro
IPC(International Patent Classification)
Specified countries National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
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