TOP > 外国特許検索 > COPPER PARTICLE MIXTURE AND METHOD FOR MANUFACTURING SAME, COPPER PARTICLE MIXTURE DISPERSION, INK CONTAINING COPPER PARTICLE MIXTURE, METHOD FOR STORING COPPER PARTICLE MIXTURE, AND METHOD FOR SINTERING COPPER PARTICLE MIXTURE

COPPER PARTICLE MIXTURE AND METHOD FOR MANUFACTURING SAME, COPPER PARTICLE MIXTURE DISPERSION, INK CONTAINING COPPER PARTICLE MIXTURE, METHOD FOR STORING COPPER PARTICLE MIXTURE, AND METHOD FOR SINTERING COPPER PARTICLE MIXTURE NEW

外国特許コード F190009691
整理番号 (S2017-0624-N0)
掲載日 2019年1月23日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2018JP014637
国際公開番号 WO 2018190246
国際出願日 平成30年4月5日(2018.4.5)
国際公開日 平成30年10月18日(2018.10.18)
優先権データ
  • 特願2017-080971 (2017.4.14) JP
発明の名称 (英語) COPPER PARTICLE MIXTURE AND METHOD FOR MANUFACTURING SAME, COPPER PARTICLE MIXTURE DISPERSION, INK CONTAINING COPPER PARTICLE MIXTURE, METHOD FOR STORING COPPER PARTICLE MIXTURE, AND METHOD FOR SINTERING COPPER PARTICLE MIXTURE NEW
発明の概要(英語) The present invention provides a copper particle mixture and a method for manufacturing the same, a copper particle mixture dispersion in which the copper particle mixture is dispersed, and an ink containing the copper particle mixture, the ink containing the copper particle mixture dispersion, the copper particle mixture whereby oxidation of the copper is suppressed, and the copper particle mixture has high dispersibility and can be sintered at low temperature in a short time in a reducing atmosphere or a non-reducing atmosphere. The present invention is a copper particle mixture including copper fine particles A and copper nanoparticles B, the copper particle mixture being characterized in that the copper fine particles A have an average particle diameter of 0.1 µm to 5 µm and are coated by at least one species of dicarboxylic acid selected from the group consisting of malonic acid and oxalic acid, the copper nanoparticles B comprise a center part comprising a copper single crystal and a protective layer on the periphery of the center part, the average particle diameter of the copper nanoparticles B is 1 nm to less than 100 nm, and the protective layer of the copper nanoparticles B includes at least one species selected from the group consisting of a C3-6 primary alcohol, a C3-6 secondary alcohol, and a derivative thereof.
従来技術、競合技術の概要(英語) BACKGROUND ART
The extent size is 2nm-100nm diameter of the nano-particles, optical properties, magnetic properties, thermal properties, electrical properties and the like, is different from the properties of the bulk metal from, a variety of techniques are expected to be applied to the art.For example, have a small particle size and increase surface area by using the characteristic that a decrease in melting point, metal nano-particles including fine wiring using the ink for printing, fine metal wires on the substrate to produce an electronic circuit has been studied.
In such a fine wiring pattern is printing ink, an organic material to protect the surface of the metal nanoparticle dispersion liquid containing the ink material, a fine wiring of a substrate using a printing technique on the printed circuit pattern, by the low temperature heating, the metal nano fine particles and organic substances removed from the surface of the metal bonding between the nano-particles occurs.In particular, the use of nano-particles of a diameter of 10nm or less, lowering the melting point of noticeable.Thus, thermal conductivity and high electric conductivity can be a metal to form a fine wiring.
As the metal wiring, is used in the bulk copper.The bulk copper, the oxide tends to decrease conductivity, has disadvantages that the firing temperature is high.On the other hand, the copper nanoparticles having a lower sintering temperature than copper Bulk, such as paper or plastic is weak against heat even on a substrate as a material for wiring can be formed in a metal microstructure has been expected.
However, copper nanoparticles, gold, silver or the like compared to other nano-particles are easily aggregated, the aggregation of several hundred nm - several tens nm in order to have a particle size, the ink is particularly useful as a material having an average particle diameter of 10nm or less of the copper nanoparticles dispersion of the synthesis is difficult.
Is weak to heat metal to a substrate such as paper or plastic fine wiring can be formed as nano-ink, a significant drop in the melting point of 10nm or less of copper nanoparticles having an average particle diameter is desired, a low temperature of 150°C or less copper nanoparticles which were sintered at a low temperature is difficult to obtain.This is, 10nm or less of copper nanoparticles having an average particle size, high reactivity and therefore unstable and, oxidation and agglomeration of the copper nanoparticles is easily occurs.Immediately after the copper nano-particles of copper nanoparticles is difficult to stably be stored.Therefore, the average particle diameter of copper nanoparticles is very small size of 10nm, the surface of the polymer strongly bonded to the copper and the like manufactured using a protective agent.However, the protective agent, a low temperature cannot be completely removed at the time of heating, the electric conductivity of the metal fine wires leading to a reduction in the problem.
In addition, the copper nanoparticles and the metal to form a fine wiring, fine wiring and ionization of the copper oxide, on the insulating substrate is moved to induce a short circuit, a problem that the so-called migration phenomenon.
As described above solves the problem that the printing ink as a material for fine wiring, and a center portion of a single crystal of copper, and a protective layer formed around the copper nanoparticles, (1) average particle diameter of 10nm or less, (2) the protective layer, having a carbon number of 3-6 1 primary alcohols, secondary alcohols having a carbon number of 3-6 2 is selected from 1 and derivatives thereof include at least one, (3) a thermal decomposition temperature or a boiling point of the protective layer is 150°C or less of the copper nanoparticles have been proposed (for example, see Patent Document 1).
Patent Document 1 may be of copper nanoparticles, copper oxidation, melting point, excellent in dispersibility, and sintered at a low temperature, and the protective layer at a low temperature of 150°C or less can be removed during sintering, the copper nanoparticles have a conductive ink material can be suitably used in the copper nanoparticles is excellent in, further lowering the sintering temperature of the studied there is room for improvement.For printing the ink material is fine wiring, the non-reducing atmosphere at a sintering at a low temperature of 120°C or less is required and possible, and, in a reducing atmosphere of the atmosphere in a non-low temperature less than 150°C, sintering in a short time is obtained.
Accordingly, and to suppress oxidation of copper, high dispersibility, and, in a reducing atmosphere or in a non-reducing atmosphere in a short time for low-temperature sintering is possible, as the conductive ink material can be preferably used a mixture of copper particles, copper particles are dispersed in the mixture of the copper particle dispersion liquid mixture, and the copper particle mixture containing a dispersion liquid containing a mixture of copper particles has been required the development of ink, the copper particle mixture can be stored stably in the development of the storage method is demanded.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • THE SCHOOL CORPORATION KANSAI UNIVERSITY
  • 発明者(英語)
  • KAWASAKI, Hideya
国際特許分類(IPC)

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