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SWALLOWING SENSOR DEVICE AND METHOD OF MANUFACTURING SAME

外国特許コード F190009723
整理番号 (S2018-0491-N0)
掲載日 2019年3月29日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2019JP009974
国際公開番号 WO 2019181643
国際出願日 平成31年3月12日(2019.3.12)
国際公開日 令和元年9月26日(2019.9.26)
優先権データ
  • 特願2018-052757 (2018.3.20) JP
発明の名称 (英語) SWALLOWING SENSOR DEVICE AND METHOD OF MANUFACTURING SAME
発明の概要(英語) A swallowing sensor device (I) comprises: sensors (50) that include a sensor (6) and a device (60) for wirelessly transmitting information detected by the sensor (6); and a set of substrates (10) which is composed of a plurality of rigid substrates (1, 2, 3) that are stacked. The set of substrates (10) includes: a first rigid substrate (1) on which a portion (51) of the sensors (50) is mounted; a second rigid substrate (2) on which another portion (52) of the sensors (50) other than the portion (51) is mounted; and a third rigid substrate (3) which is disposed between the first rigid substrate (1) and the second rigid substrate (2), and has a through hole (HT) formed therethrough for electric connection between the portion (51) and the other portion (52).
従来技術、競合技術の概要(英語) BACKGROUND ART
Conventional, built-in sensors of the capsule sensor device has been known. Such aspect of the sensor device comprises a capsule, swallowed by a subject, the body used in the detection of a vital signs. The above-mentioned sensor device, a thermometer or other sensor or camera or the like for the sensor device such as a built-in sensors, the sensors are mounted on a built-in board.
In this way the sensor device may include a built-in various types of devices, the size of the required shape or swallow. Therefore, for a built-in device, one is not arranged on a substrate, a plurality of substrates is disposed in a distributed manner has been proposed. Further, a plurality of sensors mounted on the rigid substrate with each other is also connected by the flexible substrate has been proposed. For example, sensors are provided between the rigid substrate are connected by a flexible substrate in the rigid flexible board, rigid board of a stack of state between the flexible substrate is bent in the sensor device has been studied (see Patent Document 1).
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • TOHOKU UNIVERSITY
  • 発明者(英語)
  • MIYAGUCHI, Hiroshi
国際特許分類(IPC)
指定国 National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO JP KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
参考情報 (研究プロジェクト等) COI STREAM(COITOHOKU)

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