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METHOD FOR PRODUCING COMPOSITE INCLUDING METAL COATED WITH SOLID MICROPARTICLES 新技術説明会

外国特許コード F190009842
整理番号 (2017-024)
掲載日 2019年7月25日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2018JP038040
国際公開番号 WO 2019078100
国際出願日 平成30年10月12日(2018.10.12)
国際公開日 平成31年4月25日(2019.4.25)
優先権データ
  • 特願2017-200202 (2017.10.16) JP
発明の名称 (英語) METHOD FOR PRODUCING COMPOSITE INCLUDING METAL COATED WITH SOLID MICROPARTICLES 新技術説明会
発明の概要(英語) Provided is a feature with which it is easy to accumulate solid microparticles and also form a pattern, which was difficult to achieve in the prior art. A method for producing a composite including a metal coated with solid microparticles, the method including a step in which: a metal is deposited, by radiation of ultrashort-pulse laser light, in a solution that includes metal ions, a colloid, and/or a complex; and solid microparticles dispersed in the solution coat the deposited metal, the solid microparticles comprising metal oxide particles, non-metal oxide particles, or ceramic particles.
従来技術、競合技術の概要(英語) BACKGROUND ART
In recent years, various dry coating due to collision of the fine particles in which an attempt is made. This technique, the kinetic energy of the particulates, by the collision, both temporally and spatially and locally by converting it into thermal energy, the material to a high temperature (higher than the melting point), caused by the binding particles, the coating is formed. Fine particles of the coating due to collision as an example, first, and a method using an electric field. More specifically, electrostatic coating (EPID) microparticle bombardment method (raw material particles in hardness than the lower substrate material is used, a method for embedding fine particles in the raw material of the substrate), the cluster ion beam method or the like. In addition, the method according to the transport gas (a gas deposition method (GD) ) also. According to this method, the metal nano-crystal film at room temperature can be formed. In addition, the film density of the film formed by this method is, about 55-80% of the theoretical density is considered, in order to obtain electrical conduction of the bulk material, the crystal growth is necessary due to the heat. Further, the aerosol deposition method (AD) is noted (Patent Document 1). According to this method, a ceramic material including a metal at room temperature, a dense and high-hardness film can be made therein. In addition, a fine pattern can be obtained without etching is also reported, such as the working environment is the difficulty of handling fine powders. May be any of these methods, but require a large-scale device.
On the other hand, as the laser used in laser light irradiation, the ultrashort pulsed-laser, utilizing a very short time width to the main, prior to the thermal effect on the material characteristics such as very large energy is considered to have instantaneously. For example, in Non-Patent Document 1, an example of machining by the ultrashort pulse laser has been reported, according to this, copper as a target (pico second) pulse 10ps when irradiated with a laser beam, the electron temperature may reach several thousand °C surface of the other hand, the thermal diffusion length is equal to or less than the estimated µm.
Therefore, a silver ion solution is irradiated with an ultrashort pulsed laser light, and reducing the metal ions in the solution to precipitate silver has been reported. For example, in Non-Patent Document 2, the wavelength 800nm, pulse width 80fs, frequency 82MHz, the output 14.97mW of a high intensity laser beam irradiation by reduction of silver ions, silver dot is obtained and reported. In addition, in Non-Patent Document 3, the near-infrared light source of wavelength 1064nm, wavelength 532nm or 633nm of the visible light source is used, a relatively weak continuous oscillation by utilizing a pulsed laser, by utilizing reducing reaction of silver nitrate and silver nanoparticles formed on a glass substrate patterned assembly was reported.
These laser light irradiation in order to perform the patterning material, material to be processed is the laser beam having an appropriate light absorption characteristics becomes essential. For example, Ag ink is irradiated with laser light to the metal (Ag) may be formed of a pattern, the ink is moderately absorbed by the laser light being sheared.
Ultrashort pulse laser light in the oscillation wavelength of the light is focused inside the transparent glass and a high, only near the focusing point can be processed directly. Is the non-patent document 4, an example of processing of a transparent material by the femtosecond laser has been reported, the wavelength 800nm, pulse width of the pulse light 120fs is irradiated to the silica glass, the glass inside the focal point produce induced lattice defects density has been reported. However, this approach to a solution of a solid fine particles dispersed in the light collection is difficult, also be achieved by, for the modification of the material properties of the irradiated, the property of the physical properties of the solid particles also cannot be avoided. The inventors of the present invention, according to an ultra short pulse laser, an ultra-short pulse derived from using a nonlinear optical absorption, a material having no absorption of the original methods of integrating a result of the study, the present invention achieved the present invention.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • YAMAGATA UNIVERSITY
  • 発明者(英語)
  • NISHIYAMA HIROAKI
国際特許分類(IPC)
指定国 National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO JP KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG

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