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Radiation detecting element, radiation detecting apparatus and manufacturing method of radiation detecting element UPDATE 実績あり

外国特許コード F190009919
整理番号 08312-US
掲載日 2019年8月26日
出願国 アメリカ合衆国
出願番号 201514838316
公報番号 20160061963
公報番号 9678221
出願日 平成27年8月27日(2015.8.27)
公報発行日 平成28年3月3日(2016.3.3)
公報発行日 平成29年6月13日(2017.6.13)
優先権データ
  • 特願2014-172299 (2014.8.27) JP
発明の名称 (英語) Radiation detecting element, radiation detecting apparatus and manufacturing method of radiation detecting element UPDATE 実績あり
発明の概要(英語) When a scintillator and a reinforcing member are bonded by using an adhesive, scattering and reflection occur at interfaces between the scintillator and the adhesive and between the adhesive and the reinforcing member. Due to this, a blurred image is formed on a sensor, and the resolution deteriorates. A radiation detecting element comprises: a substrate transparent to visible light; and a fluorescent screen that emits fluorescence in response to radiation by a dopant added to a material that is the same as a material of the substrate, wherein the fluorescent screen is thinner than the substrate, and the substrate and the fluorescent screen are bonded while maintaining continuity of a refractive index.
従来技術、競合技術の概要(英語) BACKGROUND
1. Technical Field
The present invention relates to a radiation detecting element, a radiation detecting apparatus, and a manufacturing method of a radiation detecting element.
2. Related Art
It has been known that a scintillator of a measuring apparatus to measure radiation is made thin while maintaining the strength of the scintillator by bonding the scintillator and a transparent reinforcing member with an adhesive to make them thin, as described for example in Japanese Patent Application Publication No. 2012-26821.
However, when a scintillator and a reinforcing member are bonded by using an adhesive, scattering and reflection occur at interfaces between the scintillator and the adhesive and between the adhesive and the reinforcing member. Due to this, a blurred image is formed on a sensor, and the resolution deteriorates.
特許請求の範囲(英語) [claim1]
1. A manufacturing method of a radiation detecting element comprising:
bonding, by solid state diffusion, a substrate transparent to visible light and a fluorescent screen that emits fluorescence in response to radiation by a dopant added to a material that is the same as a material of the substrate; and
thinning the fluorescent screen, wherein
the bonding includes applying pressure to the substrate and the fluorescent screen.

[claim2]
2. The manufacturing method according to claim 1, wherein, the bonding includes applying pressure to the substrate and the fluorescent screen in the bonding directions of the substrate and the fluorescent screen.

[claim3]
3. The manufacturing method according to claim 1, wherein the thinning includes polishing the fluorescent screen.

[claim4]
4. The manufacturing method according to claim 1, wherein the bonding is performed after a bonding surface of the substrate is superposed on a bonding surface of the fluorescent screen.
  • 発明者/出願人(英語)
  • KAMESHIMA Takashi
  • RIKEN
国際特許分類(IPC)

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