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TRANSPARENT MATERIAL PROCESSING METHOD, TRANSPARENT MATERIAL PROCESSING DEVICE, AND TRANSPARENT MATERIAL NEW

外国特許コード F190009945
整理番号 (S2018-0219-N0)
掲載日 2019年10月24日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2018JP047072
国際公開番号 WO 2019135362
国際出願日 平成30年12月20日(2018.12.20)
国際公開日 令和元年7月11日(2019.7.11)
優先権データ
  • 特願2018-000508 (2018.1.5) JP
発明の名称 (英語) TRANSPARENT MATERIAL PROCESSING METHOD, TRANSPARENT MATERIAL PROCESSING DEVICE, AND TRANSPARENT MATERIAL NEW
発明の概要(英語) The present invention enables simple and efficient material processing. This transparent material processing method is for processing a thermosetting transparent material. The transparent material processing method includes: a disposing step (S01) for disposing a pre-thermosetting thermosetting transparent material; a laser beam emission step (S02) for emitting a laser beam onto the disposed pre-thermosetting thermosetting transparent material to form cavitation bubbles in the pre-thermosetting thermosetting transparent material; and a curing step (S03) for curing the pre-thermosetting thermosetting transparent material that includes cavitation bubbles formed therein.
従来技術、競合技術の概要(英語) BACKGROUND ART
Polydimethylsiloxane (PDMS) which is typically a transparent material is a thermosetting resin, high transparency, chemical stability, excellent and inexpensive light having the properties. Therefore, electronic, electric power or the like in the industry as well as the use of, the bio and medical fields, as the material of the biochip and the medical device has been used in recent years. Currently, these materials is a fine processing technique, photolithography or molding using the mold is mainly used. In addition, using a laser micro-fabrication technology, as well as scanning laser light in a desired shape can be realized for microfabrication. A general purpose transparent material using a laser to a fine processing technique, (for example, see Patent Document 1) by the LIPAA LIBWE and (for example, see Patent Document 2) the method is.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • HIROSAKI UNIVERSITY
  • 発明者(英語)
  • HANADA Yasutaka
国際特許分類(IPC)
指定国 National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO JP KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG

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