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NEGATIVE THERMAL EXPANSION MATERIAL, COMPOSITE MATERIAL, AND METHOD FOR PRODUCING NEGATIVE THERMAL EXPANSION MATERIAL NEW 新技術説明会

外国特許コード F190009974
掲載日 2019年10月28日
出願国 世界知的所有権機関(WIPO)
国際出願番号 2019JP007225
国際公開番号 WO 2019167924
国際出願日 平成31年2月26日(2019.2.26)
国際公開日 令和元年9月6日(2019.9.6)
優先権データ
  • 特願2018-032930 (2018.2.27) JP
発明の名称 (英語) NEGATIVE THERMAL EXPANSION MATERIAL, COMPOSITE MATERIAL, AND METHOD FOR PRODUCING NEGATIVE THERMAL EXPANSION MATERIAL NEW 新技術説明会
発明の概要(英語) This negative thermal expansion material having a negative thermal expansion coefficient is characterized by being represented by Zr2-aMaSxP2O12+δ. Where, M is at least one selected from Ti, Ce, Sn, Mn, Hf, Ir, Pb, Pd, and Cr, e is 0 ≤ a < 2, x is 0.4 ≤ x ≤ 1, and δ is a value determined to satisfy the charge-neutral condition. The present invention makes it possible to provide a negative thermal expansion material, a composite material, and a method for producing a negative thermal expansion material capable of realizing cost reduction and density reduction.
従来技術、競合技術の概要(英語) BACKGROUND ART
The electronic device or optical device, a fuel cell or a sensor or the like, a plurality of material are combined to form a device, as well as misalignment due to the thermal expansion problem, each of the difference in thermal expansion coefficient of the material of the peeling at the interface and leads to a serious failure such as disconnection. Therefore, thermal expansion or thermal expansion material near-zero various has been studied a technique of controlling. The invar alloy, glass, cordierite or the like, a single phase is the thermal expansion of the widely known near-zero, in consumer products and industrial products have been applied. In recent years, a low thermal expansion coefficient by a complex structure of the filler, it is difficult to control the coefficient of thermal expansion in a single tone of the low thermal expansion material has been studied. In particular, low thermal expansion at a blend ratio can be effectively cancelled, a material having a negative thermal expansion coefficient (hereinafter, also referred to as a negative thermal expansion material) and has been attracting attention as a complex.
Patent Document 1 is, as a material having a negative thermal expansion coefficient, 3 Bi1-xSbxNiO (however, x is at 0.02≦x≦0.20) is disclosed.
  • 出願人(英語)
  • ※2012年7月以前掲載分については米国以外のすべての指定国
  • TOKYO INSTITUTE OF TECHNOLOGY
  • 発明者(英語)
  • ISOBE Toshihiro
  • HAYAKAWA Yuko
  • ADACHI Yuri
  • UEHARA Ryosuke
国際特許分類(IPC)
指定国 National States: AE AG AL AM AO AT AU AZ BA BB BG BH BN BR BW BY BZ CA CH CL CN CO CR CU CZ DE DJ DK DM DO DZ EC EE EG ES FI GB GD GE GH GM GT HN HR HU ID IL IN IR IS JO JP KE KG KH KN KP KR KW KZ LA LC LK LR LS LU LY MA MD ME MG MK MN MW MX MY MZ NA NG NI NO NZ OM PA PE PG PH PL PT QA RO RS RU RW SA SC SD SE SG SK SL SM ST SV SY TH TJ TM TN TR TT TZ UA UG US UZ VC VN ZA ZM ZW
ARIPO: BW GH GM KE LR LS MW MZ NA RW SD SL SZ TZ UG ZM ZW
EAPO: AM AZ BY KG KZ RU TJ TM
EPO: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
OAPI: BF BJ CF CG CI CM GA GN GQ GW KM ML MR NE SN ST TD TG
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