|発明の名称||ELECTRICALLY CONDUCTIVE MATERIAL, ELECTRONIC CIRCUIT SUBSTRATE, AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT SUBSTRATE|
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic circuit substrate comprising an electrically conductive portion whose electric conductivity is relatively high and an insulative portion having a resistance ratio sufficient for it without being accompanied by the waste of a material and the complication of a process for processing, and an electrically conductive material for use in manufacturing the electronic circuit substrate.
SOLUTION: The electrically conductive material is obtained by thinning a material including polymer having a structure shown by general formula (1) as a base unit to a film and then heat-processing it. Further, the electrically conductive material comprises a substrate and an electrically conductive film deposited on the substrate. The electrically conductive film is formed such that it partially has insulating characteristic by applying the material including polymer on the surface of the substrate, applying ultraviolet light to a predetermined position of the surface of the applied material under the existence of oxygen, and then heat-processing it.
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