|発明の名称||APPARATUS AND METHOD FOR DEPOSITING FILM|
PROBLEM TO BE SOLVED: To provide a method and apparatus for depositing a film by which a metal film can be deposited easily and surely in a liquid without limiting the kinds of liquids and which is utilized to fix samples such as a fine substance.
SOLUTION: The apparatus for depositing a film is used for depositing a metal film 3 on a substrate 2 to be deposited in a liquid. The apparatus is equipped with: an opposed substrate 4 which is arranged opposed to the substrate to be deposited in a state that a liquid W is interposed on the substrate to be deposited and on the opposing surface 4a of which a metal layer 5 is previously formed; and a voltage applying means which forms the metal film 3 by applying a voltage not lower than a predetermined voltage between the substrate to be deposited and the metal layer 5 to migrate metal fine particles 5a toward the substrate to be deposited from the metal layer by electrophoresis and at the same time, to deposit the metal fine particles 5a on the substrate to be deposited.
- 国立大学法人静岡大学 イノベーション社会連携推進機構
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