|発明の名称||DEVICE AND METHOD FOR ELECTROPLATING MICRO MATERIAL|
PROBLEM TO BE SOLVED: To provide an electroplating device for micro materials where the breakage of micro plating objects such as chip components can be prevented without giving impact thereto, further, many plating objects and cathode side electrodes are electrically conducted during a plating process, so as to obtain secure plating conditions even in any object, and to provide an electroplating method using the device.
SOLUTION: A hollow vessel 20 stored with micro plating objects 40 such as chip parts together with a plating liquid 50 is rotated, as the plating objects 40 are always located in a groove at the lower part of the vessel, their contacting conditions with the inside face of the vessel are changed, and the opportunity of the electric conduction between each plating object 40 and electrodes 30 is uniformly produced, thus the plating conditions can be remarkably improved without giving impact or the like to the plating objects 40. In this way, suitable electroplating can be performed.
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