Sn-Cu ALLOY THIN FILM HAVING ANTIBACTERIAL PROPERTY, Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY, AND METHOD FOR PRODUCING Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY
Patent code | P10A015552 |
---|---|
Posted date | Jul 9, 2010 |
Application number | P2005-171670 |
Publication number | P2006-342418A |
Patent number | P5017638 |
Date of filing | Jun 10, 2005 |
Date of publication of application | Dec 21, 2006 |
Date of registration | Jun 22, 2012 |
Inventor |
|
Applicant |
|
Title |
Sn-Cu ALLOY THIN FILM HAVING ANTIBACTERIAL PROPERTY, Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY, AND METHOD FOR PRODUCING Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY
|
Abstract |
PROBLEM TO BE SOLVED: To provide an Sn-Cu alloy thin film having antibacterial properties in spite of its inexpensiveness, to provide an Sn-Cu alloy thin film-formed article coated with the same and having antibacterial properties, and to provide a method for securely and easily producing an Sn-Cu alloy thin film-formed article having antibacterial properties under the condition where an environmental load is not high. SOLUTION: In the Sn-Cu alloy thin film having antibacterial properties, the containing ratio between Sn and Cu comprised in a thin film on the outermost surface layer formed on the ground of a base material satisfies 100-x [atomic%]:x [atomic%] (wherein, x is the content of Cu, and 10≤x≤90), and also, the thin film comprises 1 to 10 [mass%] SnO2. Further, in the Sn-Cu alloy thin film having antibacterial properties, the total value of forming ratios at which the above Cu forms at least either Cu6Sn5 or Cu3Sn is 10 to 100%. |
Outline of related art and contending technology |
(In Japanese)
|
Field of industrial application |
(In Japanese) 本発明は、Sn-Cu合金薄膜と、これを施したSn-Cu合金薄膜形成品、Sn-Cu合金薄膜形成品の製造方法に関する。より詳しくは、抗菌性を有するSn-Cu合金薄膜と、これを施した抗菌性を有するSn-Cu合金薄膜形成品と抗菌性を有するSn-Cu合金薄膜形成品の製造方法に関する。 |
Scope of claims |
(In Japanese) 【請求項1】 基材の素地上に、層厚1~50μmのCu層を形成するCu層形成工程と、 前記Cu層上に、層厚1~50μmのSn層を形成するSn層形成工程と、 前記Cu層および前記Sn層を形成した前記基材を250~400℃、1~5時間の条件で加熱し、Cuの含有率が10~90[原子%]であり、Cu6Sn5およびCu3Snのうちの少なくとも一方を形成した、SnとCuの合金薄膜を形成する合金薄膜形成工程と、 加熱され、前記合金薄膜が形成された前記基材を400℃/時間~50℃/分間の速度で冷却し、Sn-Cu合金薄膜形成品とする冷却工程と、 を含んでなる抗菌性を有するSn-Cu合金薄膜形成品の製造方法。 【請求項2】 前記Cu層形成工程および前記Sn層形成工程が、各々、めっき処理、スパッタ処理、または蒸着処理によって、それぞれを単層として積層させることを特徴とする請求項1に記載の抗菌性を有するSn-Cu合金薄膜形成品の製造方法。 |
IPC(International Patent Classification) |
|
F-term |
|
Drawing
※Click image to enlarge. |
|
State of application right | Registered |
Contact Information for " Sn-Cu ALLOY THIN FILM HAVING ANTIBACTERIAL PROPERTY, Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY, AND METHOD FOR PRODUCING Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY"
- SUZUKA NATIONAL COLLEGE OF TECHNOLOGY (In Japanese)総務課地域連携係
- URL: https://www.suzuka-ct.ac.jp/english/
-
E-mail:
- Address: Shiroko-cho, Suzuka, Mie, Japan , 510-0294
- Fax: 059-387-0338