|発明の名称||SUPERCONDUCTING CIRCUIT DEVICE|
PROBLEM TO BE SOLVED: To improve mechanical strength of the connection between a substrate and a superconducting circuit chip while preventing the occurrence of a disconnection caused by a thermal cycle between a room temperature and the temperature of 4.2 K (a liquid-helium temperature).
SOLUTION: A superconducting magnetic sensor chip (2) is flip-connected to the surface of the substrate (1). The superconducting circuit chip (2) and a substrate around it are covered with a resin (4). A venthole (1b) is bored in the substrate immediately under the superconducting magnetic sensor chip (2). Gas G sealed in a space covered by the resin (4) or gas G generated by liquid helium that penetrates during cooling and is evaporated during a temperature rise escapes through the venthole (1b). Therefore, it is possible to prevent the occurrence of the disconnection caused by the thermal cycle. Since the superconducting magnetic sensor chip (2) and the substrate around it are covered with the resin (4), it is also possible to improve the mechanical strength of the connection between both of them.
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