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Solder alloy, solder paste, preform solder (Patent unpublished to the public) meetings

Patent code P190016055
File No. IP2018-015
Posted date May 22, 2019
Application number P2018-219012
Date of filing Nov 22, 2018
Inventor
  • SHOJI IKUO
  • KOBAYASHI TATSUYA
Applicant
  • NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
Title Solder alloy, solder paste, preform solder (Patent unpublished to the public) meetings
Abstract (In Japanese)Sbを5~10質量%、Niを0.05~0.25質量%、それぞれ含有し、残部はSnからなる合金組成を有することにより、鉛フリーはんだの内で最高の融点を持つSn-5Sbはんだ合金を上回る機械的特性や疲労特性を示す。
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