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(In Japanese)半導体積層構造体の製造方法および半導体積層構造体 (Patent unpublished to the public) commons

Patent code P190016094
File No. FU802
Posted date Jun 12, 2019
Application number P2018-163908
Date of filing Aug 31, 2018
Inventor
  • (In Japanese)橋本明弘
Applicant
  • (In Japanese)国立大学法人福井大学
Title (In Japanese)半導体積層構造体の製造方法および半導体積層構造体 (Patent unpublished to the public) commons
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