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(In Japanese)サーモパイル型温度制御素子 (Patent unpublished to the public) NEW_EN meetings

Patent code P190016133
Posted date Jun 18, 2019
Application number P2018-246534
Date of filing Dec 28, 2018
Inventor
  • UCHIDA KENICHI
Applicant
  • National Institute for Materials Science
Title (In Japanese)サーモパイル型温度制御素子 (Patent unpublished to the public) NEW_EN meetings
Abstract (In Japanese)異方性磁気ペルチェ効果が生じる磁性体を用いたサーモパイル構造を有する温度制御素子において、冷却・加熱能力を増大させる改良されたサーモパイル型温度制御素子を提供すること。
IPC(International Patent Classification)
Reference ( R and D project ) Spin Caloritronics Group,
Research Center for Magnetic and Spintronic Materials,
National Institute for Materials Science


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