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(In Japanese)多孔質材料への固体の封入方法 (Patent unpublished to the public) commons meetings

Patent code P190016174
File No. N19005
Posted date Jul 1, 2019
Application number P2019-100085
Date of filing May 29, 2019
Title (In Japanese)多孔質材料への固体の封入方法 (Patent unpublished to the public) commons meetings
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