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(In Japanese)半導体量子ドットの分離装置及び分離方法 (Patent unpublished to the public)

Patent code P200017003
File No. FU913
Posted date Jul 3, 2020
Application number P2020-039762
Date of filing Mar 9, 2020
Inventor
  • (In Japanese)熊倉 光孝
Applicant
  • (In Japanese)国立大学法人福井大学
Title (In Japanese)半導体量子ドットの分離装置及び分離方法 (Patent unpublished to the public)
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