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(In Japanese)多孔質材料への固体の導入方法 (Patent unpublished to the public)

Patent code P200017027
File No. N20004
Posted date Jul 9, 2020
Application number P2020-094285
Date of filing May 29, 2020
Priority data
  • P2019-100085 (May 29, 2019) JP
Title (In Japanese)多孔質材料への固体の導入方法 (Patent unpublished to the public)
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