(In Japanese)錯体固定化触媒
(Patent unpublished to the public)
| Patent code | P200017214 |
|---|---|
| File No. | 2018-046 |
| Posted date | Sep 29, 2020 |
| Application number | P2020-140869 |
| Date of filing | Aug 24, 2019 |
| Inventor |
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| Applicant |
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| Title |
(In Japanese)錯体固定化触媒
(Patent unpublished to the public)
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| Abstract | (In Japanese)繰り返し使用可能な比較的低コストの、ヒドロシリル化触媒能を有する錯体触媒の提供。錯体固定化触媒であって、三座配位子金属錯体化合物及び基材を備え、三座配位子金属錯体化合物が基材に固定化された、触媒。 |
Contact Information for " (In Japanese)錯体固定化触媒"
- UNIVERSITY PUBLIC CORPORATION OSAKA OSAKA CITY UNIVERSITY (In Japanese)URAセンター
- URL: https://www.osaka-cu.ac.jp/ja/research/ura
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E-mail:
- Address: 3-3-138, Sugimoto, Sumiyoshi-ku, Osaka, Japan , 558-8585
- Fax: 06-6605-2058
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