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Cu Composite and its applications to electronic components and mounting boards.Manufacturing methods for Cu composite and bonded joint using Cu composite. (Patent unpublished to the public) meetings

Patent code P200017233
Posted date Oct 1, 2020
Application number P2020-148313
Date of filing Sep 3, 2020
Inventor
  • OHGUCHI KEN-ICHI
  • FUKUCHI KOHEI
  • Other
Applicant
  • Akita University
Title Cu Composite and its applications to electronic components and mounting boards.Manufacturing methods for Cu composite and bonded joint using Cu composite. (Patent unpublished to the public) meetings
Abstract To provide a material for mounting electronic components by Cu3Sn bonding with low pressure in a short time and a manufacturing method for the material.
Reference ( R and D project ) (In Japanese)平成23年度 第2回 究成果最適展開支援プログラム(A-STEP)
フィージビリティスタディ【FS】ステージ 探索タイプ
「複合材料化した微小試験片による金属間化合物の変形特性評価法の開発」
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