(In Japanese)半導体構造および半導体構造の制御方法
(Patent unpublished to the public)
| Patent code | P210017374 |
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| File No. | PA31-103 |
| Posted date | Jan 8, 2021 |
| Application number | P2019-147580 |
| Date of filing | Aug 9, 2019 |
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| Applicant |
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| Title |
(In Japanese)半導体構造および半導体構造の制御方法
(Patent unpublished to the public)
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Contact Information for " (In Japanese)半導体構造および半導体構造の制御方法"
- Kanazawa Institute of Technology Research Development & Promotion Division
- URL: http://www.kanazawa-it.ac.jp/ekit/index.html
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E-mail:
- Address: 7-1 Ogigaoka Nonoichishi Ishikawa Japan , 921-8501
- Fax: 081-76-248-9508
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