Top > Search of Japanese Patents > (In Japanese)半導体構造および半導体構造の制御方法

(In Japanese)半導体構造および半導体構造の制御方法 (Patent unpublished to the public) meetings

Patent code P210017374
File No. PA31-103
Posted date Jan 8, 2021
Application number P2019-147580
Date of filing Aug 9, 2019
Inventor
  • (In Japanese)井田 次郎
  • (In Japanese)森 貴之
Applicant
  • (In Japanese)学校法人金沢工業大学
Title (In Japanese)半導体構造および半導体構造の制御方法 (Patent unpublished to the public) meetings


PAGE TOP

close
close
close
close
close
close
close