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* Published Japanese patents only


Hits 6 results

No. Application number
Gazette No
Title
Release Date
Update Date
Information Provider
1 P2014-097154 P6562196 METHOD FOR MANUFACTURING COPPER FINE PARTICLE SINTERED BODY AND CONDUCTIVE SUBSTRATE Feb 5, 2016 Sep 30, 2019 Hokkaido University
2 P2013-180326 P6344894 HYBRID MAGNETIC CORE LOADING POWER INDUCTOR Dec 25, 2013 Jul 19, 2018 Shinshu University
3 P2013-063891 P6226262 FLEXIBLE WIRING BOARD AND MOUNT STRUCTURE THEREOF Jul 2, 2013 Dec 20, 2017 Shinshu University
4 P2010-075515 P5582498 ELECTRIC CONDUCTOR AND METHOD FOR FORMING THE SAME Aug 13, 2010 Jan 17, 2018 Shinshu University
5 P2006-039271 P4848502 CONDUCTIVE PASTE AND ITS MANUFACTURING METHOD, WIRING CABLE USING THE SAME AND ITS MANUFACTURING METHOD, AND ELECTRONIC COMPONENT AND ELECTRONIC DEVICE USING THE SAME Sep 14, 2007 Feb 20, 2018 Techno Network Shikoku co.,ltd.
6 P2004-064789 P4500995 ELECTRICALLY CONDUCTIVE MATERIAL, ELECTRONIC CIRCUIT SUBSTRATE, AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT SUBSTRATE Oct 4, 2005 Mar 7, 2018 HIROSHIMA UNIVERSITY

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