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* Published Japanese patents only


Hits 16 results

No. Application number
Gazette No
Title
Release Date
Update Date
Information Provider
1 P2018-003897 P2018-125524A CARBON CONCENTRATION MEASUREMENT METHOD AND CARBON CONCENTRATION MEASUREMENT DEVICE Feb 14, 2020 Feb 21, 2020 Meiji University
2 P2016-145940 P2018-018869A EVALUATION METHOD FOR INTERFACE OF CRYSTAL GROWTH LAYER BY MICROSCOPIC PHOTO-RESPONSE METHOD Apr 26, 2017 Jan 15, 2020 University of Fukui
3 P2015-206611 P6677407 OBSERVATION METHOD OF TOMOGRAPHIC STRUCTURE, OBSERVATION DEVICE, AND COMPUTER PROGRAM meetings May 24, 2016 May 26, 2020 Wakayama University
4 P2015-036074 P6525189 STANDARD SAMPLE FOR CALIBRATING OBSERVATION CONTRAST IN SCANNING ELECTRON MICROSCOPE, AND METHOD OF INSPECTING CRYSTALLINE SUBSTRATE USING SCANNING ELECTRON MICROSCOPE Apr 19, 2016 Jun 20, 2019 Kwansei Gakuin University
5 P2012-253129 P6052536 PHOTOINDUCTION CARRIER LIFETIME MEASUREMENT DEVICE, AND PHOTOINDUCTION CARRIER LIFETIME MEASUREMENT METHOD Nov 19, 2015 Dec 25, 2017 Tokyo University of Agriculture and Technology
6 P2013-232352 P6291797 METHOD AND DEVICE FOR EVALUATING ATOMIC VACANCY IN SILICON WAFER SURFACE LAYER meetings Jun 25, 2014 Mar 22, 2018 Niigata University
7 P2013-232353 P6244833 METHOD FOR DETERMINING ABSOLUTE VALUE OF ATOMIC VACANCY CONCENTRATION IN SILICON WAFER meetings Jun 25, 2014 Dec 27, 2017 Niigata University
8 P2011-022414 P5747406 METHOD OF EVALUATING CRYSTAL PARTICLE SIZE AND PARTICLE SIZE DISTRIBUTION IN METAL LAYER AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME meetings May 9, 2011 Jan 10, 2018 Ibaraki University
9 P2007-524074 P4742279 (In Japanese) 温度測定装置及びこれを利用した熱処理装置、温度測定方法 meetings Mar 12, 2010 May 24, 2019 HIROSHIMA UNIVERSITY
10 P2007-081132 P4967132 METHOD FOR INSPECTING DEFECT IN SURFACE OF OBJECT meetings Nov 20, 2009 Feb 19, 2018 Kyushu Institute of Technology
11 P2009-106852 P5557368 SEMICONDUCTOR INSPECTION DEVICE AND SEMICONDUCTOR INSPECTION METHOD Aug 7, 2009 Jan 25, 2018 Tokyo Denki University
12 P2009-077629 P5057176 PATTERN FOR EVALUATING METAL WIRING, SEMICONDUCTOR DEVICE AND EVALUATION METHOD Apr 17, 2009 Jan 24, 2018 Japan Science and Technology Agency
13 P2003-004364 P3837531 MICROSCOPE, MICRO-PLASMA ARRAY FOR MICROSCOPE, METHOD OF OBSERVING SURFACE, AND METHOD OF REFORMING SURFACE Dec 28, 2007 Mar 14, 2018 Saitama University
14 P2005-303364 P5167527 INSTRUMENT FOR MEASURING ELECTRIC CHARACTERISTICS Aug 31, 2007 Feb 27, 2018 Tokyo University of Agriculture and Technology
15 P2004-100093 P4515131 THRESHOLD CURRENT DENSITY PREDICTING SYSTEM DUE TO EM DAMAGES OF MULTI-LAYERED STRUCTURE WIRING meetings Nov 11, 2005 Mar 8, 2018 Japan Science and Technology Agency
16 P2001-091521 P3862964 METHOD FOR MEASURING LEVEL IN FORBIDDEN BAND BY TWO- WAVELENGTH EXCITATION PHOTO-LUMINESCENCE AND DEVICE THEREFOR Aug 28, 2003 Mar 16, 2018 Japan Science and Technology Agency

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